IDT72V223/233/243/253/263/273/283/293 3.3V HIGH DENSITY SUPERSYNC II
參數(shù)資料
型號(hào): IDT72V233L6PF
廠商: IDT, Integrated Device Technology Inc
文件頁(yè)數(shù): 37/45頁(yè)
文件大?。?/td> 0K
描述: IC FIFO 1024X18 6NS 80QFP
標(biāo)準(zhǔn)包裝: 5
系列: 72V
功能: 異步,同步
存儲(chǔ)容量: 18.4K(1K x 18)
數(shù)據(jù)速率: 166MHz
訪問(wèn)時(shí)間: 4ns
電源電壓: 3.15 V ~ 3.45 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 80-LQFP
供應(yīng)商設(shè)備封裝: 80-TQFP(14x14)
包裝: 托盤
其它名稱: 72V233L6PF
42
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V223/233/243/253/263/273/283/293 3.3V HIGH DENSITY SUPERSYNC IITM NARROW BUS FIFO
512 x 18, 1K x 9/18, 2K x 9/18, 4K x 9/18, 8K x 9/18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9
FEBRUARY 11, 2009
JTAG INTERFACE
Five additional pins (TDI, TDO, TMS, TCK and
TRST) are provided to
supporttheJTAGboundaryscaninterface.TheIDT72V223/72V233/72V243/
72V253/72V263/72V273/72V283/72V293 incorporates the necessary tap
controller and modified pad cells to implement the JTAG facility.
Note that IDT provides appropriate Boundary Scan Description Language
program files for these devices.
The Standard JTAG interface consists of four basic elements:
Test Access Port (TAP)
TAP controller
Instruction Register (IR)
Data Register Port (DR)
The following sections provide a brief description of each element. For a
completedescriptionrefertotheIEEEStandardTestAccessPortSpecification
(IEEE Std. 1149.1-1990).
The Figure below shows the standard Boundary-Scan Architecture
Figure 32. Boundary Scan Architecture
TEST ACCESS PORT (TAP)
The Tap interface is a general-purpose port that provides access to the
internaloftheprocessor. Itconsistsoffourinputports(TCLK,TMS,TDI,
TRST)
and one output port (TDO).
THE TAP CONTROLLER
The Tap controller is a synchronous finite state machine that responds to
TMS and TCLK signals to generate clock and control signals to the Instruction
and Data Registers for capture and update of data.
T
A
P
TAP
Cont-
roller
Mux
DeviceID Reg.
Boundary Scan Reg.
Bypass Reg.
clkDR, ShiftDR
UpdateDR
TDO
TDI
TMS
TCLK
TRST
clklR, ShiftlR
UpdatelR
Instruction Register
Instruction Decode
Control Signals
4666 drw35
相關(guān)PDF資料
PDF描述
LTC1322ISW#PBF IC TXRX RS232/485/EIA562 24-SOIC
LTC1322ISW IC TXRX RS232/485/EIA562 24-SOIC
IDT72841L10PF8 IC FIFO SYNC 4KX9 10NS 64QFP
MS3122E-12-3P CONN RECEPT 3POS W/PINS CRIMP
MS27467P17B35S CONN PLUG 55POS STRAIGHT W/SCKT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IDT72V233L6PF8 功能描述:IC FIFO 1024X18 6NS 80QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:7200 功能:同步 存儲(chǔ)容量:288K(16K x 18) 數(shù)據(jù)速率:100MHz 訪問(wèn)時(shí)間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應(yīng)商設(shè)備封裝:64-TQFP(14x14) 包裝:托盤 其它名稱:72271LA10PF
IDT72V233L7-5BC 功能描述:IC FIFO 1024X18 7-5NS 100BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:7200 功能:同步 存儲(chǔ)容量:288K(16K x 18) 數(shù)據(jù)速率:100MHz 訪問(wèn)時(shí)間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應(yīng)商設(shè)備封裝:64-TQFP(14x14) 包裝:托盤 其它名稱:72271LA10PF
IDT72V233L7-5BCI 功能描述:IC FIFO 1024X18 7-5NS 100BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:7200 功能:同步 存儲(chǔ)容量:288K(16K x 18) 數(shù)據(jù)速率:100MHz 訪問(wèn)時(shí)間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應(yīng)商設(shè)備封裝:64-TQFP(14x14) 包裝:托盤 其它名稱:72271LA10PF
IDT72V233L7-5PF 功能描述:IC FIFO 1024X18 7-5NS 80QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:7200 功能:同步 存儲(chǔ)容量:288K(16K x 18) 數(shù)據(jù)速率:100MHz 訪問(wèn)時(shí)間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應(yīng)商設(shè)備封裝:64-TQFP(14x14) 包裝:托盤 其它名稱:72271LA10PF
IDT72V233L7-5PF8 功能描述:IC FIFO 1024X18 7-5NS 80QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:7200 功能:同步 存儲(chǔ)容量:288K(16K x 18) 數(shù)據(jù)速率:100MHz 訪問(wèn)時(shí)間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應(yīng)商設(shè)備封裝:64-TQFP(14x14) 包裝:托盤 其它名稱:72271LA10PF