參數(shù)資料
型號: ICS8741004AGLFT
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 6/19頁
文件大?。?/td> 0K
描述: IC PCI EXPRSS/JITT ATTEN 24TSSOP
標(biāo)準(zhǔn)包裝: 2,500
系列: HiPerClockS™, FemtoClock™, PCI Express® (PCIe)
類型: 扇出緩沖器(分配),漂移衰減器
PLL:
主要目的: PCI Express(PCIe)
輸入: HCSL,LVDS,LVHSTL,LVPECL,SSTL
輸出: LVDS
電路數(shù): 1
比率 - 輸入:輸出: 1:4
差分 - 輸入:輸出: 是/是
頻率 - 最大: 160MHz
電源電壓: 3.135 V ~ 3.465 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 24-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 24-TSSOP
包裝: 帶卷 (TR)
其它名稱: 8741004AGLFT
ICS8741004
DIFFERENTIAL-TO-LVDS/0.7V DIFFERENTIAL PCI EXPRESS JITTER ATTENUATOR
IDT / ICS PCI EXPRESS JITTER ATTENUATOR
14
ICS8741004AG REV. AMAY 29, 2008
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8741004.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS741004 is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (45mA + 12mA) = 197.5mW
Power (LVDS_output)MAX = VDDO_MAX * IDDO_MAX = 3.465V * 80mA = 277.2mW
Power (HCSL_output)MAX = 44.5mW * 2 = 89mW
Total Power_MAX = (3.465V, with all outputs switching) = 197.5mW + 277.2mW + 89mW = 563.7mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 82.3°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.564W * 82.3°C/W = 116.4°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 6. Thermal Resistance θJA for 24 Lead TSSOP, Forced Convection
θ
JA Vs. Air Flow
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
82.3°C/W
78.0°C/W
75.9°C/W
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