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| 型號(hào)： | ICS670M-03ILF |
| 英文描述： | LOW PHASE NOISE, ZERO DELAY BUFFER AND MULTIPLIER |
| 中文描述： | 低相位噪聲，零延遲緩沖器和倍增 |
| 文件頁(yè)數(shù)： | 4/6頁(yè) |
| 文件大?。?/td> | 130K |
| 代理商： | ICS670M-03ILF |
L
OW
P
HASE
N
OISE
, Z
ERO
D
ELAY
B
UFFER
AND
M
ULTIPLIER
MDS 670-03 G
4
Revision 010306
Integrated Circuit Systems
l
525 Race Street, San Jose, CA 95126
l
tel (408) 297-1201
l
www.icst.com
ICS670-03
AC Electrical Characteristics
VDD = 3.3V ±10%,
Ambient Temperature -40 to +85
°
C, unless stated otherwise
Note 1: Rising edge of ICLK compared with rising edge of CLK2, with FBCLK connected to FBIN, and 15
pF load on CLK2. See graph on page 5 for skew vs. frequency and loading.
Thermal Characteristics
Short Circuit Current
Internal Pull-up Resistor
Input Capacitance
I
OS
R
PU
C
IN
Each output
OE, select pins
OE, select pins
±50
200
5
mA
k
pF
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Parameter
Symbol
f
IN
Conditions
Min.
5
Typ.
Max.
210
210
1.5
1.5
60
Units
MHz
MHz
ns
ns
%
ps
ps
ps
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Input Clock Frequency
Output Clock Frequency
Output Rise Time
Output Fall Time
Output Clock Duty Cycle
Input to Output Skew
Maximum Absolute Jitter
Maximum Jitter
Phase Noise, relative to
carrier, 125 MHz (x5)
See table on page 2
t
OR
t
OF
t
DC
0.8 to 2.0 V, no load
2.0 to 0.8 V, no load
measured at VDD/2
Note 1
short term
one sigma
100 Hz offset
1 kHz offset
10 kHz
200 kHz
40
50
±100
±45
15
-110
-122
-124
-117
Parameter
Symbol
θ
JA
θ
JA
θ
JA
θ
JC
Conditions
Still air
1 m/s air flow
3 m/s air flow
Min.
Typ.
120
115
105
58
Max.
Units
°
C/W
°
C/W
°
C/W
°
C/W
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case
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