9-11
Absolute Maximum Ratings
Thermal Information
Supply Voltage (V
DD
- V
SS
) . . . . . . . . . . . . . . . . . . . . . . . . . . . .6.5V
Input Voltage (Any Terminal) (Note 1) . . V
SS
- 0.3V to V
DD
, + 0.3V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
Thermal Resistance (Typical, Note 2)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . .-65
o
C to 150
o
C
Maximum Lead Temperature (Soldering, 10s) . . . . . . . . . . . . 300
o
C
(MQFP - Lead Tips Only)
θ
JA
(
o
C/W)
60
80
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Due to the SCR structure inherent in the CMOS process, connecting any terminal to voltages greater than V
DD
or less than V
SS
may
cause destructive device latchup. For this reason, it is recommended that no inputs from external sources not operating on the same
power supply be applied to the device before its supply is established, and that in multiple supply systems, the supply to the ICM7211
and ICM7212 be turned on first.
2.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
ICM7211 CHARACTERISTICS
(LCD) V
DD
= 5V
±
10%, T
A
= 25
o
C, V
SS
= 0V Unless Otherwise Specified
Operating Supply Voltage Range (V
DD
- V
SS
), V
SUPPLY
Operating Current, I
DD
Oscillator Input Current, I
OSCI
Segment Rise/Fall Time, t
r
, t
f
Backplane Rise/Fall Time, t
r
, t
f
Oscillator Frequency, f
OSC
Backplane Frequency, f
BP
ICM7212 CHARACTERISTICS
(Common Anode LED)
3
5
6
V
Test circuit, Display blank
-
10
50
μ
A
μ
A
μ
s
μ
s
Pin 36
-
±
2
±
10
C
L
= 200pF
C
L
= 5000pF
Pin 36 Floating
-
0.5
-
-
1.5
-
-
19
-
kHz
Pin 36 Floating
-
150
-
Hz
Operating Supply Voltage Range (V
DD
- V
SS
), V
SUPPLY
Operating Current Display Off, I
STBY
Operating Current, I
DD
Segment Leakage Current, I
SLK
Segment On Current, I
SEG
INPUT CHARACTERISTICS
(ICM7211 and ICM7212)
4
5
6
V
Pin 5 (Brightness), Pins 27-34 V
SS
Pin 5 at V
DD
, Display all 8’s
Segment Off
-
10
50
μ
A
-
200
-
mA
-
±
0.01
±
1
μ
A
Segment On, V
O
= +3V
5
8
-
mA
Logical “1” Input Voltage, V
IH
Logical “0” Input Voltage, V
IL
Input Leakage Current, I
ILK
Input Capacitance, C
lN
BP/Brightness Input Leakage, I
BPLK
BP/Brightness Input Capacitance, C
BPI
AC CHARACTERISTICS - MULTIPLEXED INPUT CONFIGURATION
4
-
-
V
-
-
1
V
Pins 27-34
-
±
0.01
±
1
μ
A
Pins 27-34
-
5
pF
Measured at Pin 5 with Pin 36 at V
SS
All Devices
-
±
0.01
±
1
μ
A
-
200
-
pF
Digit Select Active Pulse Width, t
WH
Data Setup Time, t
DS
Data Hold Time, t
DH
Inter-Digit Select Time, t
IDS
AC CHARACTERISTICS - MICROPROCESSOR INTERFACE
Refer to Timing Diagrams
1
-
-
μ
s
500
-
-
ns
200
-
-
ns
2
-
-
μ
s
Chip Select Active Pulse Width, t
WL
Other Chip Select Either Held Active,
or Both Driven Together
200
-
-
ns
Data Setup Time, t
DS
Data Hold Time, t
DH
Inter-Chip Select Time, t
ICS
100
-
-
ns
10
0
-
ns
2
-
-
μ
s
ICM7211, ICM7212