參數(shù)資料
型號: ICL3232ECBN
廠商: INTERSIL CORP
元件分類: 通用總線功能
英文描述: 5V High-Speed RS-232 Transceivers with 0.1uF Capacitors
中文描述: DUAL LINE TRANSCEIVER, PDSO16
封裝: PLASTIC, MS-012AC, SOIC-16
文件頁數(shù): 24/27頁
文件大小: 860K
代理商: ICL3232ECBN
24
FN4910.18
March 8, 2005
ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess
of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
α
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
0.25(0.010)
B
M
M
L
0.25
0.010
GAUGE
PLANE
A2
M20.209
(JEDEC MO-150-AE ISSUE B)
20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.068
0.078
1.73
1.99
A1
0.002
0.008’
0.05
0.21
A2
0.066
0.070’
1.68
1.78
B
0.010’
0.015
0.25
0.38
9
C
0.004
0.008
0.09
0.20’
D
0.278
0.289
7.07
7.33
3
E
0.205
0.212
5.20’
5.38
4
e
0.026 BSC
0.65 BSC
H
0.301
0.311
7.65
7.90’
L
0.025
0.037
0.63
0.95
6
N
α
20
20
7
0 deg.
8 deg.
0 deg.
8 deg.
Rev. 3 11/02
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