參數(shù)資料
型號: HYS72T64400HFN
廠商: QIMONDA
英文描述: 240-Pin Fully-Buffered DDR2 SDRAM Modules
中文描述: 240針全緩沖DDR2內(nèi)存模組
文件頁數(shù): 35/42頁
文件大小: 1262K
代理商: HYS72T64400HFN
Data Sheet
Rev. 1.10, 2006-11
11182005-JVRU-2GJ1
35
HYS72T[64/128/256]4[00/20]HFN–[3S/3.7]–A
7
Package Outline
All Components are surface mounted on one or both sides of
the PCB and positioned on the PCB to meet the minimum and
maximum trace lengths required for DDR2 SDRAM signals.
Bypass capacitors for DDR2 SDRAM devices are located
near the device power pins. The AMB device in the center of
the DIMM has a metal Heat Sink. The FB-DIMM mechanical
outlines are consistent with JEDEC MO-256.
TABLE
18
Raw Card Reference
1) Thickness includes Infineon Heat Sink. Some early production modules with Jedec Heatspreader may be thicker up to
8.2mm.
Attention: Heat Sink heat up during operation. When unplugging a DIMM from a system direct skin contact should be
avoided until the Heat Sink has reached room temperature.
Attention: The Heat Sink is mechanically loaded. Do not remove. Removal of the clip may cause injuries.
Attention: Any mechanical stress on the Heat Sink should be avoided. Touching the Heat Sink while plugging or
unplugging the module may permanently damage the DIMM.
JEDEC Raw Card
Infineon PCB
Dimensions
Width [mm]
Height [mm]
Thickness [mm]
Notes
R/C A
R/C B
R/C H
L-DIM-240-21
L-DIM-240-22
L-DIM-240-25
Figure
4
Figure
5
Figure
6
133.35
133.35
133.35
30.35
30.35
30.35
8.2
8.2
8.2
1)
1)
1)
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