參數(shù)資料
型號(hào)： HTSICH4801EW
廠商： NXP Semiconductors N.V.
元件分類： 通信及網(wǎng)絡(luò)
英文描述： HITAG S transponder IC
封裝： HTSFCH4801EV/DH<SOT732-1 (FCP2)|<<http://www.nxp.com/packages/SOT732-1.html<1<Always Pb-free,;HTSFCH5601EV/DH<SOT732-1 (FCP2)|<<http://www.nxp.com/packages/SOT732-1.html&
文件頁(yè)數(shù)： 3/21頁(yè)
文件大小： 162K
代理商： HTSICH4801EW
HTSICH56_48_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 12 October 2011
210330
3 of 21
NXP Semiconductors
HTSICH56; HTSICH48
HITAG S transponder IC
4. Quick reference data
Table 1.
Symbol
Wafer EEPROM characteristics
t
ret
retention time
N
endu(W)
write endurance
Interface characteristics
C
i
input capacitance
[1]
Typical ratings are not guaranteed. Values are at 25
C
.
Measured with Q
coil
= 20, L
coil
= 7.5 mH, optimal tuned to resonance circuit;
V
IN1-IN2
= 2 V (RMS)
[2]
5. Ordering information
[1]
This package is also known as MOA2
Quick reference data
Parameter
Conditions
Min
Typ
[1]
Max
Unit
T
amb
55
C
10
100000
-
-
year
cycle
between IN1 and IN2
HTSICxxxxxEW/x7
[2]
199
210
221
pF
Table 2.
Type number
Ordering information
Package
Name
Wafer
Wafer
Wafer
Memory size
256 bit
2048 bit
256 bit
Description
Au-bumped die on sawn wafer, inkless
Au-bumped die on sawn wafer, inkless
Au-megabumped die on sawn wafer,
inkless
Au-megabumped die on sawn wafer,
inkless
plastic leadless module carrier
package; 35 mm wide tape
plastic leadless module carrier
package; 35 mm wide tape
metal flip chip package; 2 leads;
35 mm wide tape
metal flip chip package; 2 leads;
35 mm wide tape
plastic thermal enhanced very thin
small outline package; no leads;
2 terminals; body 3
2
0.85 mm
plastic thermal enhanced very thin
small outline package; no leads;
2 terminals; body 3
2
0.85 mm
Version
-
-
-
HTSICH5601EW/V7
HTSICH4801EW/V7
HTSICC5601EW/C7
HTSICC4801EW/C7
Wafer
2048 bit
-
HTSMOH5601EV
PLLMC
[1]
256 bit
SOT500-3
HTSMOH4801EV
PLLMC
[1]
2048 bit
SOT500-3
HTSFCH5601EV/DH
FCP2
256 bit
SOT732-1
HTSFCH4801EV/DH
FCP2
2048 bit
SOT732-1
HTSH5601ETK
HVSON2
256 bit
SOT899-1
HTSH4801ETK
HVSON2
2048 bit
SOT899-1
相關(guān)PDF資料
PDF描述
HTSICH5601EW HITAG S transponder IC
HTSMOH4801EV HITAG S transponder IC
HTSMOH5601EV HITAG S transponder IC
HUF75321P3 35A, 55V, 0.034 Ohm, N-Channel UltraFET Power MOSFETs(35A, 55V, 0.034 Ω, N溝道UltraFET功率MOS場(chǎng)效應(yīng)管)
HUF75321S3S 35A, 55V, 0.034 Ohm, N-Channel UltraFET Power MOSFETs(35A, 55V, 0.034 Ω, N溝道UltraFET功率MOS場(chǎng)效應(yīng)管)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HTSICH4801EW/V1,00 功能描述:RFID應(yīng)答器 Transponder Wafer RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
HTSICH4801EW/V4,00 功能描述:RFID應(yīng)答器 HITAG S 2048BIT, FFC BUMP RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
HTSICH4801EW/V4.00 制造商:NXP Semiconductors 功能描述:
HTSICH4801EW/V7,00 功能描述:RFID應(yīng)答器 RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
HTSICH5601EW/V1,00 功能描述:RFID應(yīng)答器 HTSICH5601EW/UNCASED RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*