參數(shù)資料
型號: HT1620
廠商: Holtek Semiconductor Inc.
英文描述: RAM Mapping 32 x 4 LCD Controller for I/O μC(存儲器映射、用于I/O接口微機的32 x 4模式LCD控制器)
中文描述: 內(nèi)存映射32 × 4 LCD控制器的I / O微控制(存儲器映射,用于的I / O接口微機的32 × 4模式液晶顯示控制器)
文件頁數(shù): 6/17頁
文件大?。?/td> 153K
代理商: HT1620
Pad Description
Pad No.
Pad Name
I/O
Description
2
VO15N
O
Half voltage circuit output pin
3
VEE
Double voltage circuit output pin
4~7
COM0~COM3
O
LCD common outputs
8~39
SEG0~SEG31
O
LCD segment outputs
40
CS
I
Chip selection input with pull-high resistor
When the CS is logic high, the data and command, read from or
written to the HT1620 are disabled. The serial interface circuit is
also reset. But if the CS is at logic low level and is input to the CS
pad, the data and command transmission between the host con-
troller and the HT1620 are all enabled.
41
RD
I
READ clock input with pull-high resistor
Data in the RAM of the HT1620 are clocked out on the falling
edge of the RD signal. The clocked out data will appear on the
DATA line. The host controller can use the next raising edge to
latch the clocked out data.
42
WR
I
WRITE clock input with pull-high resistor
Data on the DATA line are latched into the HT1620 on the rising
edge of the WR signal.
43
DATA
I/O
Serial data input/output with pull-high resistor
44
VSS
Negative power supply, Ground
45
OSCO
O
The OSCI and OSCO pads are connected to a 32.768kHz crystal
in order to generate a system clock.
46
OSCI
I
47
VDD
Positive power supply
48
IRQ
O
Time base or WDT overflow flag, NMOS open drain output
49, 50
BZ, BZ
O
2kHzor4kHztonefrequencyoutputpair(tri-stateoutputbuffer)
51, 1
CC1, CC2
I
External capacitor pin, for double voltage and half voltage circuit
use
Absolute Maximum Ratings
Supply Voltage.............................. 0.3V to 3.6V
Storage Temperature................. 50
o
C to 125
o
C
Operating Temperature............... 25
o
C to 75
o
C
Input Voltage.................V
SS
0.3V to V
DD
+0.3V
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maxi-
mum Ratings
may cause substantial damage to the device. Functional operation of this de-
vice at other conditions beyond those listed in the specification is not implied and prolonged
exposure to extreme conditions may affect device reliability.
HT1620
6
January 10, 2001
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