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critical ground plane zone.
The board layer chosen as
the ground plane island
should be maximized in area
within the ground plane
zone, and should include all
resistor and capacitor
components recommended
for use with the HSDL-1100.
The ground plane for the
HSDL-1100 module should
be connected ONLY to the
least noisy ground node
available on the PC board.
The DC-DC converter should
be located as far away from
the HSDL-1100 on the PC
board as possible (at least
3 cm away). The board may
then look like Figure 2.
If any of the above aspects of
board layout are compromised,
and it is suspected that an EMI
shield over the HSDL-1100 may
be necessary, Hewlett-Packard
can provide EMI shields, or
shielded HSDL-1100s in produc-
tion volumes. The PC board
should be prepared with the
proper through holes, if it is
suspected that an EMI shield will
be necessary (see datasheets for
HP part numbers HSDL-810x, or
HSDL-1100#S07).
Application Specific
Transmitter Design:
Transmitter Drive
The infrared LED in the HSDL-
1100 is driven by signals present
at TXD. See Figure 3.
The IrDA physical layer specifica-
tion requires t
rise
and t
fall
of the
transmitted optical signal at
4 Mb/s to be 40 ns or less. The
HSDL-1100 budgets 30 ns of t
rise
and t
fall
for the LED, and 10 ns
for t
rise
and t
fall
of the electrical
ILED pulse. In order to reach
< 30 ns t
rise
and t
fall
for the LED,
CX5
CX1
DC - DC
CONVERTER
MAIN GROUND
GROUND
PLANE ISLAND
>3 cm
Figure 2.
RLED
HSDL-1100
CX7
CX2
R1
10
TXD
7
Figure 3.
TXD PULSE
HSDL-1100 PIN 7
OPTICAL ILED PULSE
V
IH
Figure 4.
a peaking circuit of R1 and CX2 is
recommended. The R1CX2 time
constant provides overdrive for
both turn-on and turn-off of the
LED, shortening the optical t
rise
and t
fall
. In order to limit the
electrical ILED pulse t
rise
and t
fall
to 5-10 ns, TXD must be driven
with a pulse current Iih of approxi-
mately ILED/125. See Figure 4.
The HSDL-1100 datasheet Electri-
cal Specifications show that at Vih
= 4.25 V, the required Iih
≤
6.6 mA.
Using R1 = 560 ohms, Iih will be
sufficient for 5-10ns t
rise
and t
fall
of
ILED, if Vih
≥
4.25 V. If the chosen
I/O chip, controller chip, or EnDec
chip does not support Vih
≥
4.25 V at the required Iih, then R1
and CX2 can be chosen to allow for
a lower Vih at the required Iih value.
R1 can be lowered from 560 ohms
to allow for Vih < 4.25 V. CX2
should then be increased to pre-
serve the peaking characteristic.
If the I/O chip or controller chip
cannot provide the required Iih
even at Voh = 2.4 V, then a buffer
chip can be used to drive TXD of
the HSDL-1100. The output of
the buffer chip should be able
to source current of at least
4