參數(shù)資料
型號: HSDL-3612-037
英文描述: IrDA Data Compliant 115.2kb/s 3V to 5V Infrared Transceiver
中文描述: IrDA數(shù)據(jù)符合115.2kb / s的3V至5V的紅外收發(fā)器
文件頁數(shù): 17/25頁
文件大?。?/td> 356K
代理商: HSDL-3612-037
17
Allowable Misalignment Tolerance
X – direction
Theta – direction
0.2 mm (0.008 inches)
±
2 degrees
2.1 Recommended Metal Solder
Stencil Aperture
It is recommended that only
0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. The
following combination of metal
stencil aperture and metal stencil
thickness should be used:
3.0 Pick and Place Misalignment
Tolerance and Product Self-
Alignment after Solder Reflow
If the printed solder paste volume
is adequate,
the unit will self-
align
in the X-direction after
solder reflow. Units should be
properly reflowed in IR Hot Air
convection oven using the
recommended reflow profile. The
direction of board travel does not
matter.
See Fig 4.0
t, nominal stencil thickness
mm
0.152
0.127
l, length of aperture
mm
2.8
±
0.05
3.4
±
0.05
inches
0.006
0.005
inches
0.110
±
0.002
0.134
±
0.002
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions
Figure 4.0. Solder paste stencil aperture.
APERTURE AS PER
LAND DIMENSIONS
SOLDER
PASTE
l
w
t (STENCIL THICKNESS)
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