參數(shù)資料
型號(hào): HSDL-3203
廠商: Avago Technologies Ltd.
英文描述: Small Profile Package IrDA㈢ Data Compliant Low Power 115.2 kbit/s Infrared Transceiver
中文描述: 小資料包的IrDA㈢數(shù)據(jù)兼容低功耗115.2 kbit / s的紅外收發(fā)器
文件頁(yè)數(shù): 12/19頁(yè)
文件大?。?/td> 413K
代理商: HSDL-3203
12
Figure 17. Adjacent land keep-out and solder mask areas.
Stencil Thickness, t (mm)
Aperture Size (mm)
Length, l
2.60
±
0.05
3.00
±
0.05
Width, w
0.55
±
0.05
0.55
±
0.05
0.152 mm
0.127 mm
Figure 16. Solder stencil aperture.
1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure ad-
equate printed solder paste vol-
ume and no shorting. See the
table below the drawing for com-
binations of metal stencil aper-
ture and metal stencil thickness
that should be used.
Aperture opening for shield pad
is 2.7 mm x 1.25 mm as per land
pattern.
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space
occupied by
the unit relative to the land pat-
tern. There should be no other
SMD components within this
area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm
. It is recommended that
two fiducial crosses be placed at
mid-length of the pads for unit
alignment.
Note:
Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
APERTURES AS PER
LAND DIMENSIONS
l
w
t
0.2
3.0
8.2
SOLDER MASK
2.6
UNITS: mm
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