參數(shù)資料
型號: HSDL-3020
廠商: Avago Technologies Ltd.
英文描述: IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver
中文描述: 紅外線㈢數(shù)據(jù)兼容低功耗4.0 Mbit / s的紅外遙控器
文件頁數(shù): 14/24頁
文件大小: 212K
代理商: HSDL-3020
14
Recommended Metal solder Stencil
Aperture
It is recommended that only a
0.152 mm (0.006 inch) or a
0.127 mm (0.005 inch) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See
Table
1
, below the drawing, for combin-
ations of metal stencil aperture
and metal stencil thickness that
should be used. Aperture opening
for shield pad is 3.05 mm x 1.1
mm as per land pattern.
Figure 3. Solder stencil aperture.
Table 1.
Aperture Size (mm)
Stencil Thickness, t (mm)
Length, l
1.75
±
0.05
2.4
±
0.05
Width, w
0.55
±
0.05
0.55
±
0.05
0.127 mm
0.11 mm
APERTURES AS PER
LAND DIMENSIONS
l
w
t
Adjacent Land Keepout and Solder
Mask Areas
Adjacent land keepout is the
maximum space occupied by the
unit relative to the land pattern.
There should be no other SMD
components within this area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm. It is recommended that
two fiducial crosses be placed at
mid length of the pads for unit
alignment.
Note:
Wet/Liquid Photo-imageable
solder resist/mask is recommended.
h
l
j
k
SOLDER MASK
DIMENSION
h
l
k
j
mm
0.2
3.0
3.85
11.9
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