參數(shù)資料
型號: HSDL-1100
英文描述: General Application Guide for the HSDL-1100 4 Mb/s Infrared Transceiver
中文描述: 一般應用手冊的HSDL - 1100 4 Mb / s的紅外收發(fā)器
文件頁數(shù): 3/6頁
文件大小: 43K
代理商: HSDL-1100
3
amplifier for both receiver chan-
nels contains daylight cancellation
circuitry to eliminate the ambient
light portion of incoming Ir signals.
Lead Bend Options
Lead bend options for the HSDL-
1100 include the TOP (#X08
option), and FRONT (#X07 option).
The TOP and FRONT options are
similar to that shown on page 13 of
the Hewlett-Packard IrDA Design
Guide, and are shown in detail on
the HSDL-1100 datasheet. The TOP
option lies flat on the circuit board,
while the FRONT stands upright on
the circuit board.
Implementation of the
HSDL-1100
Required External Components
Table 2 describes the external
components required for obtaining
datasheet performance (Actual
values for the components may
vary with the I/O chip, controller
chip, EnDec chip, or buffer chip
that the HSDL-1100 interfaces to).
Board Layout Requirements
Proper board layout is crucial to
the noise immunity of the overall Ir
system. Compromised board
layout may lead to reduced
sesitivity, and therefore shorter
achievable Ir link distance. Proper
board layout is descibed in detail
in page 16 of the Hewlett-Packard
IrDA Design Guide.
Keys aspects of proper board
layout are:
V
CC
to Gnd bypass capacitor
CX5 should be placed within
0.5 cm of the HSDL-1100
module pins 2,4, AND on the
same side of the PC board as
the HSDL-1100 module.
The PIN bypass capacitor
CX1 should be <0.5 cm from
pin 1 of the HSDL-1100
module.
A multi-layer PC board
should be used, and one
layer devoted to a ground
plane for the HSDL-1100
module. The ground plane
should be laid out as an
island, with one connection
to a clean (<20 mV noise)
system ground or analog
system ground, and sepa-
rated from the ground
connection of fast switching
devices, or noise sources.
The board underneath and
1 cm in any direction around
the module is defined as the
Component
Description
Recommended Value
560
±
5%, 0.125 watt
R1
Txd input resistor for transmitter peaking.
RLED (R2)
LED bias resistor which sets LED current pulse
amplitude.
4.7
±
5%, 0.5 watt (See Transmitter
Drive Requirements Section)
10-50
±
5%, 0.125 watt
R3
Power supply noise filter resistor. The higher the
value, the lower the minimum filter frequency.
1/(R3CX5) is the minimum filter frequency.
CX1
PIN bypass capacitor to reduce noise at the PIN
detector.
0.47
μ
F,
±
10%, X7R ceramic, <0.5 cm
from pin 1.
220 pF,
±
10%, X7R ceramic
CX2
Txd input capacitor for transmitter peaking.
CX3
Adaptive threshold capacitor.
1000 pF,
±
10%, X7R ceramic
CX4
Adaptive threshold averaging capacitor.
0.010
μ
F,
±
10%, X7R ceramic
CX5
V
CC
to Gnd bypass capacitor. Should be within
0.5 cm of module pins 2,4.
0.47
μ
F,
±
20%, X7R ceramic, <0.5 cm
lead length, within 0.5 cm from pins
2, 4.
6.8
μ
F, Tantalum. Larger value
recommended for noisy supplies
or environments.
0.47
μ
F, ceramic. Used to eliminate
ripple on V
CC
caused by the LED
current during infrared transmission.
CX6
V
CC
to Gnd bypass capacitor.
CX7
V
CC
transmitter bypass capacitor
Table 2.
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相關(guān)代理商/技術(shù)參數(shù)
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HSDL-1100#007 制造商:未知廠家 制造商全稱:未知廠家 功能描述:IrDA 1.1Compliant 4Mb/s 5V Transceiver.Front Option.Tape & Reel<LI>(Not Recommended for New Designs)
HSDL-1100#008 制造商:Hewlett Packard Co 功能描述:SPECIALTY INTERFACE CIRCUIT, DMA10
HSDL-1100#017 制造商:未知廠家 制造商全稱:未知廠家 功能描述:IrDA 1.1Compliant 4Mb/s 5V Transceiver.Front Opt.10 units/strip<LI>(Not Recommended for New Designs)
HSDL-1100#018 制造商:未知廠家 制造商全稱:未知廠家 功能描述:IrDA 1.1Compliant 4Mb/s 5V Transceiver. Top Opt. 10 units/strip<LI>(Not Recommended for New Designs)
HSDL1100#0X7 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FIBER OPTIC TRANSCEIVER