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參數(shù)資料
| 型號： | HPND-0001 |
| 英文描述： | Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits(小信號射頻PIN二極管晶片（用于混合集成電路）) |
| 中文描述： | 小信號射頻PIN二極管芯片的混合集成電路（小信號射頻的PIN二極管晶片（用于混合集成電路）） |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 31K |
| 代理商： | HPND-0001 |
Maximum Ratings
Junction Operating and Storage
Temperature Range ..............................................................-65
°
C to +150
°
C
T
A
= 25
°
C
P
D
Power Dissipation.........................................................................250 mW
(Measured in an infinite heat sink derated linearly
to zero at 150
°
C.)
Operation in excess of any one of these conditions may result in
permanent damage to this device.
Electrical Specifications at T
A
= 25
°
C
Typical Parameters
Chip for
Epoxy or
Eutectic
Die Attach
HPND-
0001
0002
Test
Conditions
Nearest
Equivalent
Surface Mount
Part No.
HSMP-
3800
3810
Nearest
Equivalent
Axial Lead
Part No.
5082-
3080
3081
Minimum
Breakdown
Voltage
V
BR
(V)
100
100
V
= V
Measure
I
R
≤
10 mA
Typical
Carrier
Lifetime
τ
(ns)
1800
1500
I
F
= 50 mA
I
R
= 250 mA
*I
F
= 10 mA
*I
R
= 6 mA
Typical Reverse
Recovery
Time
t
rr
(ns)
500
300
I
F
= 20 mA
V
= 10 V
90% Recovery
Maximum
Capacitance
C
j
(pF)
0.20
0.20
V
R
= 50 V
*V
= 20 V
f = 1.0 MHz
Series
Resistance
R
S
(
)
2.0
3.5
I
F
= 100 mA
*I
F
= 10 mA
Assembly and Handling
Procedures for PIN Chips
1. Storage
Devices should be stored in a dry
nitrogen purged dessicator or
equivalent.
2. Cleaning
If required, surface contamination
may be removed with electronic
grade solvents. Typical solvents,
such as freon (T.F. or T.M.C.),
acetone, deionized water, and
methanol, or their locally ap-
proved equivalents, can be used
singularly or in combinations.
Typical cleaning times per solvent
are one to three minutes. DI water
and methanol should be used (in
that order) in the final cleans.
Final drying can be accomplished
by placing the cleaned dice on
clean filter paper and drying with
an infrared lamp for 5-10 minutes.
Acids such as hydrofluoric (HF),
nitric (HNO
3
), and hydrochloric
(HCl) should not be used.
The effects of cleaning methods/
solutions should be verified on
small samples prior to submitting
the entire lot.
Following cleaning, dice should
be either used in assembly
(typically within a few hours) or
stored in clean containers in a
reducing atmosphere or a vacuum
chamber.
3. Die Attach
a. Eutectic
Eutectic die attach can be accom-
plished by “scrubbing” the die
with/without a preform on the
header to combine with the silicon
in the die. Temperature is approxi-
mately 400
°
C, with heating times
of 5-10 seconds. (Note–times and
temperature utilized may vary
depending on the type, composi-
tion, and heat capacity of the
header or substrate used.) This
method is recommended for the
HPND-000X series.
b. Epoxy
For epoxy die-attach, conductive
silver-filled epoxies are recom-
mended. This method can be used
for all Agilent PIN chips.
4. Wire Bonding
Either ultrasonic, thermosonic or
thermocompression bonding
techniques can be employed.
Suggested wire is pure gold, 0.7 to
1.5 mil diameter.
www.semiconductor.agilent.com
Data subject to change.
Copyright 1999 Agilent Technologies
Obsoletes 5954-2108
5965-9143E (11/99)
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| HPND-0002 | 功能描述:PIN 二極管 100 VBR 0.2pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向電壓:200 V 正向連續(xù)電流: 頻率范圍:10 MHz to 6 GHz 端接類型:SMD/SMT 封裝 / 箱體:QFN-3 封裝:Reel |
| HPND-4005 | 功能描述:PIN 二極管 120 VBR 0.017pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向電壓:200 V 正向連續(xù)電流: 頻率范圍:10 MHz to 6 GHz 端接類型:SMD/SMT 封裝 / 箱體:QFN-3 封裝:Reel |
| HPND-4018 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Beam Lead PIN Diodes for Phased Arrays and Switches (71K in pdf) |
| HPND-4028 | 功能描述:PIN 二極管 60 VBR 0.025 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向電壓:200 V 正向連續(xù)電流: 頻率范圍:10 MHz to 6 GHz 端接類型:SMD/SMT 封裝 / 箱體:QFN-3 封裝:Reel |
| HPND-4038 | 功能描述:PIN 二極管 60 VBR 0.025 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向電壓:200 V 正向連續(xù)電流: 頻率范圍:10 MHz to 6 GHz 端接類型:SMD/SMT 封裝 / 箱體:QFN-3 封裝:Reel |
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