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參數(shù)資料
| 型號： | HPMD-7904 |
| 英文描述： | FBAR Duplexer for US PCS Band |
| 中文描述： | 的FBAR雙工器1930.5 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 110K |
| 代理商： | HPMD-7904 |
7
Solder Recommendations
The HPMD-7904 FBAR duplexer
(and its variants) is an assembly
consisting of two LCC ceramic
packages, containing the Tx and
Rx filters, mounted to a small
circuit board. Both packages on
the circuit board are mounted in
place using Sn96.5/Ag3.5 solder
(shaded in Table 1).
Figure 15. Device Orientation.
USER
FEED
DIRECTION
COVER TAPE
CARRIER
TAPE
User Feed Direction
Top View
Empty Pocket/Cavity
Leader: 100 pocket
–
1 Meter
Trailer: 100 pocket
–
1 Meter
End View
REEL
xx
DO
xx
DO
xx
DO
xx
DO
xx
DO
xx
DO
xx
DO
xx
DO
The recommended solder profile
for the FBAR duplexer is shown
in Figure 16. Guidelines and a
typical profile are both shown.
This typical profile was tested on
ten samples of the duplexer, each
of which was subjected to the
profile six times without effect
upon the mechanical or electrical
characteristics of the device.
Alloy type
Melting temp.
(
o
C)
Recommended working
temperature (
o
C)
Comments
Sn42Bi58
138
160
–
180
Lead free
Sn43Pb43Bi14
144
–
163
165
–
185
Contains lead
–
some customers prohibit it.
Sn63Pb37
183
200
–
240
Contains lead
–
some customers prohibit it.
Sn60Pb40
186
200
–
240
Contains lead
–
some customers prohibit it.
Sn91/Zn9
199
200
–
240
May have oxidation problems
Sn96.2Ag2.5Cu0.8Sb0.5
216
235
–
255
Popular lead free composition
Sn95.8Ag3.5Cu0.7
217
235
–
255
Other alloy ratios are available
Sn96.5Ag3.5
221
240 – 260
Used in the assembly of duplexers
Sn100
232
260
–
280
Too hot
–
will melt the duplexer
Sn95Sb5
235
260
–
280
Too hot
–
will melt the duplexer
Sn97Cu3
240
260
–
300
Too hot
–
will melt the duplexer
Table 1. Solder Compositions
Solder temperatures and times in
excess of those given in the
guidelines of Table 1 may result
in damage to the duplexer or
changes in its characteristics.
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