參數(shù)資料
型號(hào): HMMC-5033
英文描述: 17.7-32 GHz MMIC Power Amplifier(17.7-32 GHz單片微波集成電路功率放大器)
中文描述: 17.7-32 GHz單片功率放大器(17.7-32 GHz的單片微波集成電路功率放大器)
文件頁數(shù): 3/6頁
文件大?。?/td> 673K
代理商: HMMC-5033
3
HMMC-5033 Applications
The HMMC-5033 MMIC is a
broadband power amplifier
designed for use in transmitters
that operate in various frequency
bands between 17.7 GHz and
32 GHz. It can be attached to the
output of the HMMC-5040
(20–40 GHz) or the HMMC-5618
(5.9–20 GHz) MMIC amplifier,
increasing the power handling
capability of transmitters requir-
ing linear operation.
Biasing and Operation
The recommended DC bias
condition for optimum efficiency,
performance, and reliability is
V
D1
= 3.5 volts
and
V
D2
= 5 volts
with
V
GG
set for
I
D1
+ I
D2
= 700 mA
(no connection to
V
G1
). This bias
arrangement results in default
drain currents
I
D1
= 240 mA and
I
D2
= 460 mA.
A single DC gate supply con-
nected to
V
GG
will bias all gain
stages.
If operation with both
V
D1
and
V
D2
at 5 volts is desired, an
additional wire bond connection
from the
V
G1
pad to the
V
GG
external bypass chip-capacitor
(shorting
V
G1
to
V
GG
) will balance
the currents in each gain stage.
V
GG
(=
V
G1
) can be adjusted for
I
D1
+ I
D2
= 700 mA.
Muting can be accomplished by
setting
V
G1
and/or
V
GG
to the
pinch-off voltage V
P
.
An optional output power detec-
tor network is also provided.
Detector sensitivity can be
adjusted by biasing the diodes
with typically 1 to 5 volts applied
to the
Det-Bias
terminal. Simply
connecting
Det-Bias
to the
V
D2
supply is a convenient method of
biasing this detector network.
The differential voltage between
the
Det-Ref
and
Det-Out
bonding
pads can be correlated with the
RF power emerging from the
RF
Output
port.
The RF ports are AC-coupled at
the RF input to the first stage and
the RF output of the second
stage. If the output detector is
biased using the on-chip optional
Det-Bias
network, an external
Figure 1. HMMC-5033 Simplified Schematic Diagram.
AC-blocking capacitor may be
required at the
RF Output
port.
No ground wires are needed since
ground connections are made
with plated through-holes to the
backside of the device.
Assembly Techniques
Electrical and thermal conductive
epoxy die attach is the preferred
assembly method. Solder die
attach using a fluxless gold-tin
(AuSn) solder preform can also
be used. The device should be
attached to an electrically con-
ductive surface to complete the
DC and RF ground paths. The
backside metallization on the
device is gold.
It is recommended that the
electrical connections to the
bonding pads be made using
0.7–1.0 mil diameter gold wire.
The microwave/millimeter-wave
connections should be kept as
short as possible to minimize
inductance. For assemblies
requiring long bond wires,
multiple wires can be attached to
the RF bonding pads.
Thermosonic wedge is the
preferred method for wire
bonding to the gold bond pads. A
guided-wedge at an ultrasonic
power level of 64 dB can be used
for the 0.7 mil wire. The recom-
mended wire bond stage tempera-
ture is 150
±
2
°
C.
For more detailed information
see Agilent application note #999,
“GaAs MMIC Assembly and
Handling Guidelines.”
GaAs MMICs are ESD sensitive.
Proper precautions should be used
when handling these devices.
V
D2
Det. Out
V
D1
V
G2 =
V
GG
Det. Bias
(Optional)
Det. Reference
V
G1
(Optional)
R1 = 250
R2 = 1 K
R3 = 10 K
Stage 1
Stage 2
Ref. D2
R3
R3
R3
C
RF Input
RF Output
D1
R2
R1
相關(guān)PDF資料
PDF描述
HMMC-5034 37-43 GHz MMIC Power Amplifier(37-43 GHz單片微波集成電路功率放大器)
HMMC-5038 38 GHz Adjustable High-Gain Low-Noise Amplifier( 38 GHz 可調(diào)高增益低噪聲放大器)
HMMC-5200 DC-20 GHz Feedback Amplifier(DC-20 GHz反饋放大器)
HMMC-5220 DC-15 GHz Feedback Amplifier(DC-15 GHz反饋放大器)
HMMC-5618 6-20 GHz Two-Stage Amplifier(6-20 GHz 2級(jí)放大器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HMMC-5034 制造商:未知廠家 制造商全稱:未知廠家 功能描述:37-43 GHz Amplifier
HMMC-5038 制造商:AGILENT 制造商全稱:AGILENT 功能描述:38 GHz LNA
HMMC-5040 制造商:Agilent Technologies 功能描述:RF AMP CHIP SGL GP 40GHZ 5V - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5200 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GAIN AMP CHIP - Gel-pak, waffle pack, wafer, diced wafer on film
HMMC-5220 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DC-15 GHz HBT Series-Shunt Amplifier