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參數(shù)資料
| 型號： | HMMC-2027 |
| 元件分類： | 開關(guān) |
| 英文描述： | 0 MHz - 26500 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 3 dB INSERTION LOSS |
| 封裝： | CHIP |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 76K |
| 代理商： | HMMC-2027 |
7-37
This data sheet contains a variety of typical and guaranteed performance data. The
information supplied should not be interpreted as a complete list of circuit specifica-
tions. In this data sheet the term typical refers to the 50th percentile performance. For
additional information contact your local HP sales representative.
Note:
All compression data measured in an individual device mounted in an HP83040
Series Modular Microcircuit Package @ Tcase = 25°C.
Figure 8. HMMC-2027 Bonding Pad Locations. (Dimensions in micrometers)
450
70
375
830
0
70
0
740
900
960
RF
IN
RF
OUT2
CHIP ID
740
RF
OUT1
SEL1
SEL2
525
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| HMMC-3040 | 20000 MHz - 43000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
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| HMMC-5032 | 17700 MHz - 32000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| HMMC-5033 | 17700 MHz - 32000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
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相關(guān)代理商/技術(shù)參數(shù) |
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| HMMC-3002 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/2 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3004 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/4 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3008 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/8 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
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| HMMC-3024 | 功能描述:預(yù)定標(biāo)器 Chip GaAs 12 GHz RoHS:否 制造商:ON Semiconductor 最大工作頻率:1100 MHz 最小工作頻率:100 MHz 電源電壓-最小:4.5 V 電源電壓-最大:5.5 V 工作電源電壓:5 V 最小工作溫度:- 40 C 最大工作溫度:+ 85 C 封裝:Tube |
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