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參數(shù)資料
| 型號： | HMMC-1015 |
| 廠商： | AGILENT TECHNOLOGIES INC |
| 元件分類： | 衰減器 |
| 英文描述： | 0 MHz - 50000 MHz RF/MICROWAVE VARIABLE ATTENUATOR |
| 封裝： | 0.0579 X 0.024 INCH, 0.0056 INCH HEIGHT, DIE |
| 文件頁數(shù)： | 4/7頁 |
| 文件大?。?/td> | 399K |
| 代理商： | HMMC-1015 |
4
Notes:
1) All dimensions in microns and shown to center of bond pad.
2) DC
in, V1, DCout, and V2 bonding pads are 75 x 75 microns.
3) RF input and output bonding pads are 60 x 70 microns.
4) Chip thickness: 127 ± 15 m.
Figure 2. Bonding pad locations
RF
IN
233
610
0
RF
OUT
0
476
584
887
994
1470
1410
Figure 3. Assembly diagram
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| HMMC-2027 | 0 MHz - 26500 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 3 dB INSERTION LOSS |
| HMMC-2027 | 0 MHz - 26500 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 3 dB INSERTION LOSS |
| HMMC-3040 | 20000 MHz - 43000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMMC-2006 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:DC-6 GHz Unterminated SPDT Switch |
| HMMC-2007 | 制造商:Agilent Technologies 功能描述:RF SWIT SPDT DC TO 8GHZ 38DB CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-2027 | 制造商:Agilent Technologies 功能描述:RF SWIT SPDT 0MHZ TO 26.5GHZ 27DB CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3002 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/2 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3004 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/4 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
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