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參數(shù)資料
| 型號： | HMC550E |
| 廠商： | HITTITE MICROWAVE CORP |
| 元件分類： | 開關(guān) |
| 英文描述： | 0 MHz - 6000 MHz RF/MICROWAVE SGL POLE SGL THROW SWITCH, 0.9 dB INSERTION LOSS |
| 封裝： | ROHS COMPLIANT, PLASTIC, SOT-26, SMT, 6 PIN |
| 文件頁數(shù)： | 4/6頁 |
| 文件大小： | 353K |
| 代理商： | HMC550E |
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For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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14 - 4
Absolute Maximum Ratings
RF input Power (Vctl = 0/+3.3V)
+34 dBm
Supply Voltage (Vdd)
+12 Vdc
control Voltage Range (Vctl)
-0.2 to +(Vdd + 0.2) Vdc
hot Switch Power Level
(Vctl = 0/+3.3V)
+35 dBm
channel temperature
150 °c
continuous Pdiss (t= 85 °c)
(derate 6.67 mw/ °c above 85°c)
433 mw
thermal Resistance
150 °c/w
Storage temperature
-65 to +150 °c
Operating temperature
-40 to +85 °c
Dc blocks are required at ports RF1 and RF2.
eLectROStAtic SeNSitiVe DeVice
OBSeRVe hANDLiNG PRecAUtiONS
Outline Drawing
NOteS:
1. LeADFRAMe MAteRiAL: cOPPeR ALLOY
2. DiMeNSiONS ARe iN iNcheS [MiLLiMeteRS].
3. DiMeNSiON DOeS NOt iNcLUDe MOLDFLASh OF 0.15mm PeR SiDe.
4. DiMeNSiON DOeS NOt iNcLUDe MOLDFLASh OF 0.25mm PeR SiDe.
5. ALL GROUND LeADS MUSt Be SOLDeReD tO PcB RF GROUND.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
hMc550
Low Stress injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
h550
hMc550e
RohS-compliant Low Stress injection Molded Plastic
100% matte Sn
MSL1
[2]
550e
[1] Max peak reflow temperature of 235 °c
[2] Max peak reflow temperature of 260 °c
v01.1010
HMC550 / 550E
GaAs MMIC SPST
FAILSAFE SWITCH, DC - 6 GHz
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