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參數(shù)資料
| 型號(hào)： | HMC264CB1 |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 214K |
| 代理商： | HMC264CB1 |
4 - 137
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
MICROWAVE CORPORATION
F
EBRUARY
2001
4
M
I
S
HMC264CB1 SUB-HARMONIC SMT MIXER 21 - 30 GHz
The BGA package is back-metallized and can be mounted with either eutectic solder or electrically con-
ductive epoxy. The mounting surface should be clean and flat. Placement of the BGA package can be
done manually or with available automatic placement machines.
Eutectic Attach:
Eutectic solder paste may be applied manually or automatically by screen print/dispense methods to the
PCB. Geometry and process should be such as to supply sufficient solder volume to obtain adequate
solder fillets around the balls of the package after reflow without shorting RF/DC ball signal contacts. The
solder should be reflowed in an infrared reflow oven with the appropriate temperature profile for that solder.
The finished fillet should resemble a cylindrical column with a flared pedestal at the substrate surface when
viewed from the side.
Do not expose the BGA package to temperature greater than 220
o
C for more than 20 seconds.
Epoxy Attach:
Electrically conductive epoxy may be applied in the same manner as mentioned above. Again geometry
and process parameters should be such as to supply sufficient epoxy around each of the balls of the
package without shorting RF/DC ball signal contact . Cure the epoxy per the recommended manufacture's
schedule.
Handling Precautions:
Follow these precautions to avoid permanent damage.
Cleanliness: Handle the devices in a clean environment.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes (
see page 8 - 2
).
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and
bias cables to minimize inductive pick-up.
General Handling: Handle the BGA package along the edges with a vacuum collet or with a sharp pair of
bent tweezers. Avoiding damaging the solder balls on the package bottom.
Mounting
HMC264CB1
V
01.0500
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