參數(shù)資料
型號: HMC213MS8
英文描述: Analog IC
中文描述: 模擬IC
文件頁數(shù): 5/6頁
文件大小: 114K
代理商: HMC213MS8
4 - 76
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
MICROWAVE CORPORATION
F
EBRUARY
2001
M
I
4
S
GaAs MMIC SMT DOUBLE-BALANCED MIXER 1.5 - 4.5 GHz
Evaluation Circuit Board
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads should be connected directly to the ground plane similar to
that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The
evaluation circuit board as shown is available from Hittite upon request.
Evaluation Circuit Board Layout Design Details
Layout Technique
Grounded Co-Planar Waveguide (GCPW)
Material
FR4
Dielectric Thickness
0.028" (0.71 mm)
50 Ohm Line Width
0.037" (0.94 mm)
Gap to Ground Edge
0.010" (0.25 mm)
Ground via Hole Diameter
0.014" (0.36 mm)
Connectors
SMA-F ( EF - Johnson P/N 142-0701-806)
HMC213MS8
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