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參數(shù)資料
| 型號： | HMC182S14ETR |
| 廠商： | HITTITE MICROWAVE CORP |
| 元件分類： | 開關(guān) |
| 英文描述： | 0 MHz - 2000 MHz RF/MICROWAVE DIVERSITY SWITCH, 1.2 dB INSERTION LOSS |
| 封裝： | ROHS COMPLIANT, PLASTIC, SMT, SOIC-14 |
| 文件頁數(shù)： | 3/6頁 |
| 文件大小： | 198K |
| 代理商： | HMC182S14ETR |
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Outline Drawing
Bias Voltage Range (Port Vee)
-7 Vdc
Control Voltage Range (A & B)
Vee -0.5V to +1.0 Vdc
Channel Temperature
150 °C
Thermal Resistance
(Insertion Loss Path)
123 °C/W
Thermal Resistance
(Terminated Path)
260 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Maximum Input Power
+27 dBm (<500 MHz)
+30 dBm (>500 MHz)
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
HMC182S14 / 182S14E
GaAs MMIC SP4T NON-REFLECTIVE
SWITCH, DC - 2 GHz
v03.0805
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Part Number
Package Body Material
Leadframe Plating
MSL Rating
Package Marking
[3]
HMC182S14
Low Stress Injection Molded Plastic Silica
and Silicon Impregnated
Sn/Pb Solder
MSL1
[1]
HMC182
XXXX
HMC182S14E
RoHS-compliant Low Stress Injection Molded
Plastic Silica and Silicon Impregnated
100% Matte Tin
MSL1
[2]
HMC182
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
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| HMC187AMS8E | 制造商:Hittite Microwave Corp 功能描述:IC DOUBLER PASSIVE FREQ 8-MSOP |
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