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參數(shù)資料
| 型號(hào)： | HLMP-FW00 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | 5mm Flat Top InGaN White LED Lamp |
| 中文描述： | 5毫米平頂?shù)腎nGaN白色LED燈 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大小： | 171K |
| 代理商： | HLMP-FW00 |
5
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Condition:
Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for those
parts without standoff.
Recommended soldering condition:
Wave
Soldering
105
°
C Max.
30 sec Max
50
°
C Max.
3 sec Max.
Manual
Solder Dipping
-
-
60
°
C Max.
5 sec Max
Pre-heat temperature
Preheat time
Peak temperature
Dwell time
Wave soldering parameter must be set and maintain
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25C before handling.
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
Recommended PC board plated through holes
LED component
ead size
0.457 x 0.457mm
(0.018 x 0.018inch)
0.508 x 0.508mm
(0.00 x 0.00inch)
Diagonal
0.646 mm
(0.05 inch)
0.718 mm
(0.08 inch)
Plated through
hole diameter
0.976 to 1.078 mm
(0.038 to 0.04 inch)
1.049 to 1.150mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
Recommended Wave Soldering Profile
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
250
200
150
FLUXING
TURBULENT WAVE
PREHEAT
TIME - SECONDS
T
100
50
30
0
10
20
30
40
50
60
70
80
90
100
LAMINAR WAVE
HOT AIR KNIFE
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HLMP-FW00-JM000 | 功能描述:標(biāo)準(zhǔn)LED-通孔 White Water Clear 680mcd RoHS:否 制造商:Vishay Semiconductors 照明顏色:Red 光強(qiáng)度:0.7 mcd 波長/色溫:615 nm 顯示角:45 deg 透鏡顏色/類型:Clear, Non-Diffused 正向電流:70 mA 正向電壓:1.83 V to 3.03 V LED 大小:2 mm 系列: 封裝:Tube |
| HLMP-FW66-LP000 | 功能描述:LED 5MM WHT FLAT TOP W/O STNDOFF RoHS:是 類別:光電元件 >> LED - Millicandela 等級(jí):2260mcd 正向電壓:2.1V 電流 - 測(cè)試:20mA 波長 - 主:590nm 波長 - 峰值:- 視角:- 透鏡類型:散射，有色 透鏡樣式/尺寸:圓頂橢圓，5.1mm x 3.7mm 封裝/外殼:徑向 尺寸/尺寸:- 高度:7.00mm 安裝類型:通孔 包裝:散裝 在特定電流下的光通量 - 測(cè)試:- |
| HLMP-FW66-LP000 | 制造商:Avago Technologies 功能描述:Lamp5mmInGaNWhiteFlat Top |
| HLMP-FW66-LP0DD | 功能描述:LED 5MM FLAT TOP INGAN WHITE RoHS:是 類別:光電元件 >> LED - Millicandela 等級(jí):2260mcd 正向電壓:2.1V 電流 - 測(cè)試:20mA 波長 - 主:590nm 波長 - 峰值:- 視角:- 透鏡類型:散射，有色 透鏡樣式/尺寸:圓頂橢圓，5.1mm x 3.7mm 封裝/外殼:徑向 尺寸/尺寸:- 高度:7.00mm 安裝類型:通孔 包裝:散裝 在特定電流下的光通量 - 測(cè)試:- |
| HLMP-FW66-MN000 | 功能描述:LED 5MM FLAT TOP INGAN WHITE RoHS:是 類別:光電元件 >> LED - Millicandela 等級(jí):2260mcd 正向電壓:2.1V 電流 - 測(cè)試:20mA 波長 - 主:590nm 波長 - 峰值:- 視角:- 透鏡類型:散射，有色 透鏡樣式/尺寸:圓頂橢圓，5.1mm x 3.7mm 封裝/外殼:徑向 尺寸/尺寸:- 高度:7.00mm 安裝類型:通孔 包裝:散裝 在特定電流下的光通量 - 測(cè)試:- |
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