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參數(shù)資料
| 型號： | HLMP-CW16-VY0xx |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | T-13/4 Precision Optical Performance White LED Lamps |
| 中文描述： | 的T 13 / 4精密光學(xué)性能白光LED燈 |
| 文件頁數(shù)： | 9/11頁 |
| 文件大?。?/td> | 125K |
| 代理商： | HLMP-CW16-VY0XX |
9
If necessary, use fixture to hold the LED component in
proper orientation with respect to the PCB during
soldering process.
At elevated temperature, the LED is more susceptible
tomechanical stress. Therefore, PCB must be allowed
tocool down to room temperature prior to handling,
which includes removal of jigs, fixtures or pallet.
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Avago Technologies LEDConfiguration
InGaNDevice
CATHODE
Note:
Electrical connection between bottom surface of LED die and
thelead frame material through conductive paste of solder.
Over sizing of plated through hole can lead to twisting or
improper LED placement during auto insertion. Under
sizing plated through hole can lead to mechanical stress
on the epoxy lens during clinching.
Note:
Refer to Application Note AN1027 for more information on
soldering LED components.
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
Recommended PC board plated through hole sizes for
LED component leads:
Precautions:
Lead Formng
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
inducedinto the LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
theLED chip die attach and wirebond.
For better control, it is recommended to use proper tool
to precisely form and cut the leads to applicable length
rather than doing it manually.
Soldering Conditions
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
The closest manual soldering distance of the soldering
heat source (soldering iron
’
s tip) to the body is 1.59 mm.
Soldering the LED closer than 1.59 mm might damage the
LED.
Recommended soldering conditions:
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105
°
C Max.
Pre-heat Time
Peak Temperature
Dwell Time
–
–
260
°
C Max.
5 sec Max.
30 sec Max.
250
°
C Max.
3 sec Max.
1.59 mm
Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
timein the solder wave. Customer is advised to daily
check on the soldering profile to ensure that the soldering
profile is always conforming to recommended soldering
condition.
Notes:
1. PCB with different size and design (component density) will have
different head mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to recalibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies' high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is
advisedto take extra precaution during wave soldering to ensure
that the maximum wave temperature is not exceeding 250
°
C.
Overstressing the LED during soldering process might cause
premature failure to the LED due to delamination.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HLMP-CW23 | T-13/4 Precision Optical Performance White LED Lamps |
| HLMP-CW23-SV0xx | T-13/4 Precision Optical Performance White LED Lamps |
| HLMP-CW23-SVKxx | T-13/4 Precision Optical Performance White LED Lamps |
| HLMP-CW23-TW0xx | T-13/4 Precision Optical Performance White LED Lamps |
| HLMP-CW24 | T-13/4 Precision Optical Performance White LED Lamps |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HLMP-CW18-VY0DD | 制造商:Avago Technologies 功能描述:LAMP5MMINGANWHITE15DEG |
| HLMP-CW19-VY0DD | 功能描述:標(biāo)準(zhǔn)LED-通孔 Lamp 5mm InGaN White 15deg RoHS:否 制造商:Vishay Semiconductors 照明顏色:Red 光強度:0.7 mcd 波長/色溫:615 nm 顯示角:45 deg 透鏡顏色/類型:Clear, Non-Diffused 正向電流:70 mA 正向電壓:1.83 V to 3.03 V LED 大小:2 mm 系列: 封裝:Tube |
| HLMP-CW23-SV000 | 功能描述:標(biāo)準(zhǔn)LED-通孔 White 23deg 23deg RoHS:否 制造商:Vishay Semiconductors 照明顏色:Red 光強度:0.7 mcd 波長/色溫:615 nm 顯示角:45 deg 透鏡顏色/類型:Clear, Non-Diffused 正向電流:70 mA 正向電壓:1.83 V to 3.03 V LED 大小:2 mm 系列: 封裝:Tube |
| HLMP-CW23-SV000 | 制造商:Avago Technologies 功能描述:LED LAMP |
| HLMP-CW23-SV0DD | 功能描述:標(biāo)準(zhǔn)LED-通孔 White 23deg 23deg RoHS:否 制造商:Vishay Semiconductors 照明顏色:Red 光強度:0.7 mcd 波長/色溫:615 nm 顯示角:45 deg 透鏡顏色/類型:Clear, Non-Diffused 正向電流:70 mA 正向電壓:1.83 V to 3.03 V LED 大小:2 mm 系列: 封裝:Tube |
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