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參數(shù)資料
| 型號： | HIP1030AS |
| 廠商： | HARRIS SEMICONDUCTOR |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | 1A High Side Driver with Overload Protection |
| 中文描述： | 2.5 A BUF OR INV BASED PRPHL DRVR, PSIP5 |
| 文件頁數(shù)： | 2/5頁 |
| 文件大?。?/td> | 36K |
| 代理商： | HIP1030AS |
2
Absolute Maximum Ratings
Thermal Information
Maximum Supply Voltage V
CC
. . . See O.V. Shutdown Limit, V
OVSD
Input Voltage, V
IN
(Note 1). . . . . . . . . . . . . . . . . -1V to (V
CC
- 0.5V)
Load Current, I
OUT
. . . . . . . . . . . . . . . . . . . . . . . . .Internal Limiting
Load Dump (Survival) . . . . . . . . . . . . . . . . . . . . . . . . . .
±
60V
PEAK
Reverse Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -16V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 125
o
C
Thermal Resistance (Typical, Note 2)
Plastic SIP Package . . . . . . . . . . . . . .
Maximum Power Dissipation (Note 3)
At T
A
= 125
o
C, Infinite Heat Sink. . . . . . . . . . . . . . . . . . . . . 6.25W
Maximum Junction Temperature, T
J
. . . . . . . . . . . . . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . .-40
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300
o
C
(Lead Tips Only)
θ
JA
(
o
C/W)
50
θ
JC
(
o
C/W)
4
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. The Input Control Voltage, V
IN
shall not be greater than (V
CC
- 0.5V) and shall not exceed +7V when V
CC
is greater than 7.5V.
2.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
3. The worst case thermal resistance,
θ
JC
for the SIP TS-001AA 5 lead package is 4
o
C/W. The calculation for dissipation and junction
temperature rise due to dissipation is:
P
D
= (V
CC
-V
OUT
)(I
OUT
) + (V
CC
)(I
CCMAX
- I
OUT
) or (V
CC
)(I
CCMAX
) - (V
OUT
)(I
OUT
)
T
J
= T
AMBIENT
+ (P
D
) (
θ
JC
) for an infinite Heat Sink.
Refer to Figure 1 for Derating based on Dissipation and Thermal Resistance. Derating from 150
o
C is based on the reciprocal of thermal
resistance,
θ
JC
+
θ
HS
. For example: Where
θ
JC
= 4
o
C/W and given
θ
HS
= 6
o
C/W as the thermal resistance of an external Heat Sink,
the junction-to-air thermal resistance,
θ
JA
= 10
o
C/W. Therefore, for the maximum allowed dissipation, derate 0.1W/
o
C for each degree
from T
AMB
to the maximum rated junction temperature of 150
o
C. If T
AMB
= 100
o
C, the maximum P
D
is (150 - 100) x 0.1W/
o
C = 5W.
Electrical Specifications
T
A
= -40
o
C to 125
o
C, V
IN
= 2V, V
CC
= +12V, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Operating Voltage Range
V
CC
4.5
-
25
V
Over-Voltage Shutdown
V
OVSD
R
L
= 1K
; V
IN
= 2V
26
33
38
V
Over-Temperature Limiting
T
SD
-
150
-
o
C
Negative Pulse
Output Clamp Voltage
V
CL
I
CL
= -100mA; V
CC
= 4.5V to 25V
(V
CC
- 35)
(V
CC
- 30.5)
(V
CC
- 28)
V
Short Circuit Current Limiting
I
SC
(Note 4)
1.1
1.6
2.5
A
Input Control ON
V
IH
2.0
-
-
V
Input Control OFF
V
IL
-
-
0.8
V
Input Current High
I
IH
V
IN
= 5.5V, V
CC
= 6V to 24V
6
-
40
μ
A
Input Current Low
I
IL
V
IN
= 0.8V, V
CC
= 6V to 24V
6
-
30
μ
A
Supply Current, Full Load
Input Control ON
I
CCMAX
V
IN
= 2V; I
OUT
= 1.0A;
-
1.05
1.1
A
Supply Current, No Load
Input Control OFF
I
CCMIN
V
IN
= 0V; I
OUT
= 0A;
-
55
100
μ
A
Input-Output Forward Voltage
Drop (V
CC
- V
OUT
)
V
SAT
I
OUT
= 1A; V
CC
= 4.5V to 25V
-
0.6
1
V
Output Leakage
I
OUT_LK
V
IN
= 0.8V; V
CC
= 6V to 24V
-
4
50
μ
A
Turn ON Time
t
ON
R
L
= 80
; (Note 5)
-
5
20
μ
s
Turn OFF Time
t
OFF
R
L
= 80
; (Note 5)
-
25
65
μ
s
NOTES:
4. Short circuit current will be reduced when thermal shutdown occurs. Testing of short circuit current may require a short duration pulse.
See Figure 7.
5. Refer to Figures 3A and 3B for typical switching speeds with a 20
Load.
HIP1030
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