參數資料
| 型號： | HI9P0509-5 |
| 廠商： | Intersil |
| 文件頁數： | 10/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MULTIPLEXER DUAL 4X1 16SOIC |
| 標準包裝： | 48 |
| 功能： | 多路復用器 |
| 電路： | 2 x 4:1 |
| 導通狀態(tài)電阻： | 400 歐姆 |
| 電壓電源： | 雙電源 |
| 電壓 - 電源，單路/雙路(±)： | ±14 V ~ 16 V |
| 電流 - 電源： | 1.5mA |
| 工作溫度： | 0°C ~ 75°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-SOIC（0.154"，3.90mm 寬） |
| 供應商設備封裝： | 16-SOIC |
18
FN3142.8
October 30, 2007
HI-506, HI-507, HI-508, HI-509
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpendic-
ular to datum
.
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX
12 3
N/2
N
AREA
SEATING
BASE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C
A
M
BS
E28.6 (JEDEC MS-011-AB ISSUE B)
28 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A-
0.250
-
6.35
4
A1
0.015
-
0.39
-4
A2
0.125
0.195
3.18
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.030
0.070
0.77
1.77
8
C
0.008
0.015
0.204
0.381
-
D
1.380
1.565
35.1
39.7
5
D1
0.005
-
0.13
-5
E
0.600
0.625
15.24
15.87
6
E1
0.485
0.580
12.32
14.73
5
e
0.100 BSC
2.54 BSC
-
eA
0.600 BSC
15.24 BSC
6
eB
-
0.700
-
17.78
7
L
0.115
0.200
2.93
5.08
4
N28
28
9
Rev. 1 12/00
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|---|---|
| HI9P0549-9 | IC MULTIPLEXER DUAL 4X1 16SOIC |
| HI9P5051-9 | IC SWITCH DUAL SPDT 16SOIC |
| HIN213CA-T | IC 4DRVR/5RCVR RS232 5V 28-SSOP |
| HIN232ACBN-T | IC 2DRVR/2RCVR RS232 5V 16-SOIC |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| HI9P0509-5Z | 功能描述:多路器開關 IC W/ANNEAL MUX DIFF 4:1 16N COM RoHS:否 制造商:Texas Instruments 通道數量:1 開關數量:4 開啟電阻（最大值）:7 Ohms 開啟時間（最大值）: 關閉時間（最大值）: 傳播延遲時間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:UQFN-16 |
| HI9P0509-5Z96 | 功能描述:多路器開關 IC W/ANNEAL MUX DIFF 4:1 16N COM RoHS:否 制造商:Texas Instruments 通道數量:1 開關數量:4 開啟電阻（最大值）:7 Ohms 開啟時間（最大值）: 關閉時間（最大值）: 傳播延遲時間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:UQFN-16 |
| HI9P0509-9 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HI9P0516-5 WAF | 制造商:Harris Corporation 功能描述: |
| HI9P0516-9 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
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