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參數(shù)資料
| 型號： | HI-3183PJM |
| 廠商： | HOLT INTEGRATED CIRCUITS INC |
| 元件分類： | 通用總線功能 |
| 英文描述： | ARINC 429 DIFFERENTIAL LINE DRIVER |
| 中文描述： | LINE DRIVER, PQCC28 |
| 封裝： | PLASTIC, LCC-28 |
| 文件頁數(shù)： | 5/11頁 |
| 文件大小： | 309K |
| 代理商： | HI-3183PJM |
Notes:
1. All data taken
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
as this is considered unrealistic for high speed operation.
4. Similar results would be obtained with A
shorted to B
5. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
6. Data will vary depending on air flow and the method of heat sinking employed.
7. Current values listed are for each of the +V and -V supplies.
on devices soldered to a single layer copper PCB (3" X 4.5" X .062").
.
in still air
OUT
OUT
HI-318X PACKAGE THERMAL CHARACTERISTICS
HEAT SINK - ESOIC PACKAGES
Both the 14-pin and 16-pin thermally enhanced SOIC
packages are used for HI-318X products. These ESOIC
packages include a metal heat sink located on the bottom
surface of the device. This heat sink should be soldered
down to the printed circuit board for optimum thermal
dissipation. The heat sink is electrically isolated from the
chip and can be soldered to any ground or power plane.
However, since the chip’s substrate is at +V, connecting
the heat sink to this power plane is recommended to avoid
coupling noise into the circuit.
JA
(°C/W)
JUNCTION TEMPERATURE, Tj
PACKAGE STYLE
HEAT SINK
SUPPLY CURRENT
TA = 25°C TA = 85°C TA = 125°C
14-pin Thermally
Enhanced Plastic
SOIC (ESOIC)
1
2
Unsoldered
82
36 mA
57°C
147°C
187°C
Soldered
65
36 mA
78°C
138°C
178°C
Unsoldered
51
40 mA
64°C
124°C
164°C
Soldered
28
40 mA
53°C
113°C
153°C
N/A
70
63 mA
100°C
150°C
182°C
14-pin Thermally
Enhanced Plastic
SOIC (ESOIC)
28-pin Plastic
PLCC
JA
(°C/W)
JUNCTION TEMPERATURE, Tj
PACKAGE STYLE
HEAT SINK
SUPPLY CURRENT
TA = 25°C TA = 85°C TA = 125°C
14-pin Thermally
Enhanced Plastic
SOIC (ESOIC)
1
2
Unsoldered
82
20 mA
57°C
117°C
157°C
Soldered
65
20 mA
51°C
111°C
151°C
Unsoldered
51
20 mA
45°C
105°C
145°C
Soldered
20 mA
36°C
96°C
136°C
N/A
70
25 mA
56°C
110°C
150°C
14-pin Thermally
Enhanced Plastic
SOIC (ESOIC)
28-pin Plastic
PLCC
MAXIMUM ARINC LOAD
3, 6, 7
A
and B
Shorted to Ground
OUT
OUT
3, 4, 5, 6, 7
HOLT INTEGRATED CIRCUITS
5
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
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| HI-3183PJMF | ARINC 429 DIFFERENTIAL LINE DRIVER |
| HI-3183PJTF | ARINC 429 DIFFERENTIAL LINE DRIVER |
| HI-3183PSIF | ARINC 429 DIFFERENTIAL LINE DRIVER |
| HI-3183PSM | ARINC 429 DIFFERENTIAL LINE DRIVER |
| HI-3183PSMF | ARINC 429 DIFFERENTIAL LINE DRIVER |
相關(guān)代理商/技術(shù)參數(shù) |
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| HI-3183PJMF | 制造商:HOLTIC 制造商全稱:Holt Integrated Circuits 功能描述:ARINC 429 DIFFERENTIAL LINE DRIVER |
| HI-3183PJT | 制造商:HOLTIC 制造商全稱:Holt Integrated Circuits 功能描述:ARINC 429 DIFFERENTIAL LINE DRIVER |
| HI-3183PJTF | 制造商:HOLTIC 制造商全稱:Holt Integrated Circuits 功能描述:ARINC 429 DIFFERENTIAL LINE DRIVER |
| HI-3183PSI | 制造商:HOLTIC 制造商全稱:Holt Integrated Circuits 功能描述:ARINC 429 DIFFERENTIAL LINE DRIVER |
| HI-3183PSIF | 制造商:HOLTIC 制造商全稱:Holt Integrated Circuits 功能描述:ARINC 429 DIFFERENTIAL LINE DRIVER |
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