參數(shù)資料
型號： HDSP-2133
英文描述： Eight Character 5.0 mm (0.2 inch) Glass/Ceramic Intelligent 5 x 7 Alphanumeric Displays for Military Applications(軍用的八字符5.0 mm (0.2英寸)玻璃/陶瓷智能 5 x 7文字?jǐn)?shù)字顯示器)
中文描述： 八字5.0毫米（0.2英寸）玻璃/陶瓷智能5 × 7的軍事應(yīng)用字母數(shù)字顯示器（軍用的八字符5.0毫米（0.2英寸）玻璃/陶瓷智能5 × 7文字?jǐn)?shù)字顯示器）
文件頁數(shù)： 15/16頁
文件大?。?/td> 319K
代理商： HDSP-2133
15
ESD Susceptibility
These displays have ESD sus-
ceptibility ratings of CLASS 3 per
DOD-STD-1686 and CLASS B per
MIL-STD-883C.
Soldering and Post Solder
Cleaning Instructions for
the HDSP-213X/-2179
The HDSP-213X/-2179 may be
hand soldered or wave soldered
with SN63 solder. When hand
soldering it is recommended that
an electronically temperature con-
trolled and securely grounded
soldering iron be used. For best
results, the iron tip temperature
should be set at 315
°
C (600
°
F).
For wave soldering, a rosin-based
RMA flux can be used. The solder
wave temperature should be set at
245
°
C
±
5
°
C (473
°
F
±
9
°
F), and
dwell in the wave should be set
between 1
1
/
2
to 3 seconds for
optimum soldering. The preheat
temperature should not exceed
105
°
C (221
°
F) as measured on
the solder side of the PC board.
For further information on
soldering and post solder
cleaning, see Application Note
1027,
Soldering LED
Components.
Contrast Enhancement
When used with the proper con-
trast enhancement filters, the
HCMS-213X/-2179 series displays
are readable daylight ambients.
Refer to Application Note 1029
Luminous Contrast and Sun-
light Readability of the HDSP-
235X Series Alphanumeric
Displays for Military Applica-
tions
for information on contrast
enhancement for daylight
The inputs to the CMOS IC are
protected against static discharge
and input current latchup. How-
ever, for best results standard
CMOS handling precautions
should be used. Prior to use, the
HDSP-213X should be stored in
antistatic packages or conductive
material. During assembly, a
grounded conductive work area
should be used, and assembly
personnel should wear conductive
wrist straps. Lab coats made of
synthetic material should be
avoided since they are prone to
static charge buildup. Input
current latchup is caused when
the CMOS inputs are subjected to
either a voltage below ground
(V
IN
< ground) or to a voltage
higher than V
DD
(V
IN
> V
DD
) and
when a high current is forced into
the input. To prevent input cur-
rent latchup and ESD damage,
unused inputs should be
connected either to ground or to
V
DD
. Voltages should not be
applied to the inputs until V
DD
has
been applied to the display. Tran-
sient input voltages should be
eliminated.
Thermal Considerations
The HDSP-213X/-2179 has been
designed to provide a low ther-
mal resistance path from the
CMOS IC to the 24 package pins.
This heat is then typically
conducted through the traces of
the user’s printed circuit board to
free air. For most applications no
additional heatsinking is required.
The maximum operating IC
junction temperature is 150
°
C.
The maximum IC junction tem-
perature can be calculated using
the following equation:
T
J
(IC) MAX = T
A
+ (P
D
MAX) (R
θ
J-PIN
+ R
θ
PIN-A
)
Where
P
D
MAX = (V
DD
MAX) (I
DD
MAX)
I
DD
MAX = 370 mA with 20 dots
ON in eight character locations at
25
°
C ambient. This value is from
the Electrical Characteristics
table.
P
D
MAX = (5.5 V) (0.370 A)
= 2.04 W
Ground Connections
Two ground pins are provided to
keep the internal IC logic ground
clean. The designer can, when
necessary, route the analog
ground for the LED drivers sep-
arately from the logic ground until
an appropriate ground plane is
available. On long interconnects
between the display and the host
system, the designer can keep
voltage drops on the analog
ground from affecting the display
logic levels by isolating the two
grounds.
The logic ground should be con-
nected to the same ground poten-
tial as the logic interface circuitry.
The analog ground and the logic
ground should be connected at a
common ground which can
withstand the current introduced
by the switching LED drivers.
When separate ground connec-
tions are used, the analog ground
can vary from -0.3 V to +0.3 V
with respect to the logic ground.
Voltage below -0.3 V can cause all
dots to be on. Voltage above +0.3
V can cause dimming and dot
mismatch.
相關(guān)PDF資料
PDF描述
HDSP-2179 Eight Character 5.0 mm (0.2 inch) Glass/Ceramic Intelligent 5 x 7 Alphanumeric Displays for Military Applications(軍用的八字符5.0 mm (0.2英寸)玻璃/陶瓷智能 5 x 7文字?jǐn)?shù)字顯示器)
HDSP-2301 Four Character 5.0 mm (0.20 inch) 5 x 7 Alphanumeric Displays(四字符5.0 mm (0.20英寸) 5 x 7數(shù)字文字顯示器)
HDSP-2302 Four Character 5.0 mm (0.20 inch) 5 x 7 Alphanumeric Displays(四字符5.0 mm (0.20英寸) 5 x 7數(shù)字文字顯示器)
HDSP-2303 Four Character 5.0 mm (0.20 inch) 5 x 7 Alphanumeric Displays(四字符5.0 mm (0.20英寸) 5 x 7數(shù)字文字顯示器)
HDSP-2351 Extended Temperature Four Character 5.0 mm (0.20 Inch) 5 x 7 Alphanumeric Display for Sunlight Viewable Applications(應(yīng)用于日光觀察的擴(kuò)展溫度四字符5.0 mm (0.20 英寸) 5 x 7 文字?jǐn)?shù)字顯示器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HDSP-2133-JK000 制造商:Avago Technologies 功能描述:5X7 SMARTDISP HIREL 8CHAR .2IN GRN
HDSP-2179 功能描述:LED 顯示器和配件 Orange 602nm 5x7 Smart Display RoHS:否 制造商:Avago Technologies 顯示器類型:7 Segment 數(shù)位數(shù)量:2 字符大小:7.8 mm x 14.22 mm 照明顏色:Red 波長:628 nm 共用管腳:Common Anode 工作電壓:2.05 V 工作電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 35 C 封裝:Tube
HDSP-2312TXV 制造商:Hewlett Packard Co 功能描述:5 X 7 Dot Matrix Led Display, 4-character, Red, Dip
HDSP-2500 功能描述:LED 顯示器和配件 Orange 602nm 5x7 Smart Display RoHS:否 制造商:Avago Technologies 顯示器類型:7 Segment 數(shù)位數(shù)量:2 字符大小:7.8 mm x 14.22 mm 照明顏色:Red 波長:628 nm 共用管腳:Common Anode 工作電壓:2.05 V 工作電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 35 C 封裝:Tube
HDSP-2501 功能描述:LED 顯示器和配件 Yellow 585nm 5x7 Smart Display RoHS:否 制造商:Avago Technologies 顯示器類型:7 Segment 數(shù)位數(shù)量:2 字符大小:7.8 mm x 14.22 mm 照明顏色:Red 波長:628 nm 共用管腳:Common Anode 工作電壓:2.05 V 工作電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 35 C 封裝:Tube
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*