參數(shù)資料
型號(hào): HCS151D
廠商: Intersil Corporation
英文描述: Radiation Hardened 8-Input Multiplexer
中文描述: 輻射加固8輸入多路復(fù)用器
文件頁(yè)數(shù): 9/9頁(yè)
文件大?。?/td> 175K
代理商: HCS151D
171
HCS151MS
Die Characteristics
DIE DIMENSIONS:
84 x 84 mils
2.13 x 2.13mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 x 4 mils
Metallization Mask Layout
HCS151MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS151 is TA14467A.
I2
(2)
I3
(1)
VCC
(16)
I1 (3)
I0 (4)
Y (5)
Y (6)
(8)
GND
(9)
S2
(11) S0
(12) I7
(13) I6
(14) I5
(10) S1
(7)
E
I4
(15)
Spec Number
518753
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