參數(shù)資料
型號: HCS132MS
廠商: Intersil Corporation
英文描述: Radiation Hardened Quad 2-Input NAND Schmitt Trigger
中文描述: 輻射加固四2輸入與非施密特觸發(fā)器
文件頁數(shù): 8/8頁
文件大?。?/td> 156K
代理商: HCS132MS
140
HCS132MS
Die Characteristics
DIE DIMENSIONS:
90 x 90 mils
2.29 x 2.29mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 x 4 mils
Metallization Mask Layout
HCS132MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS132 is TA14383A.
A1
(1)
B1
(2)
Y1 (3)
A2 (4)
B2 (5)
NC
GND
(7)
Y3
(8)
A3
(9)
(11) Y4
(12) A4
NC
VCC
(14)
(10) B3
B4
(13)
Y2
(6)
Spec Number
518750
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