參數(shù)資料
型號: HCS125K
廠商: Intersil Corporation
英文描述: Radiation Hardened Quad Buffer, Three-State
中文描述: 輻射加固四緩沖,三態(tài)
文件頁數(shù): 9/9頁
文件大?。?/td> 93K
代理商: HCS125K
131
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
HCS125MS
Die Characteristics
DIE DIMENSIONS:
92 x 91(mils)
2.34 x 2.31 (mm)
METALLIZATION:
Type: AlSi
Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
4 x 4 (mils)
100 x 100
m)
Metallization Mask Layout
HCS125MS
(
(
(
(
(12) A4
G
Y
A
Y1 (3)
Y
(11) Y4
(10) OE3
OE2 (4)
A2 (5)
Spec Number
518831
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