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參數(shù)資料
| 型號(hào)： | HC5513BIM |
| 廠商： | INTERSIL CORP |
| 元件分類： | 模擬傳輸電路 |
| 英文描述： | TVS UNI-DIR 40V 1500W SMC |
| 中文描述： | TELECOM-SLIC, PQCC28 |
| 封裝： | PLASTIC, LCC-28 |
| 文件頁(yè)數(shù)： | 14/18頁(yè) |
| 文件大?。?/td> | 175K |
| 代理商： | HC5513BIM |
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67
AC-DC Separation Capacitor, C
HP
The high pass filter capacitor connected between pins HPT
and HPR provides the separation between circuits sensing
tip to ring DC conditions and circuits processing AC signals.
A 10nf C
HP
will position the low end frequency response
3dB break point at 48Hz. Where:
Where R
HP
= 330k
.
Thermal Shutdown Protection
The HC5513’s thermal shutdown protection is invoked if a
fault condition on the tip or ring causes the temperature of
the die to exceed 160
o
C. If this happens, the SLIC goes into
a high impedance state and will remain there until the
temperature of the die cools down by about 20
o
C. The SLIC
will return back to its normal operating mode, providing the
fault condition has been removed.
Surge Voltage Protection
The HC5513 must be protected against surge voltages and
power crosses. Refer to “Maximum Ratings” TIPX and
RINGX terminals for maximum allowable transient tip and
ring voltages. The protection circuit shown in Figure 21
utilizes diodes together with a clamping device to protect tip
and ring against high voltage transients.
Positive transients on tip or ring are clamped to within a
couple of volts above ground via diodes D
1
and D
2
. Under
normal operating conditions D
1
and D
2
are reverse biased
and out of the circuit.
Negative transients on tip and ring are clamped to within a
couple of volts below ground via diodes D
3
and D
4
with the
help of a Surgector. The Surgector is required to block
conduction through diodes D
3
and D
4
under normal
operating conditions and allows negative surges to be
returned to system ground.
The fuse resistors (R
F
) serve a dual purpose of being
nondestructive power dissipaters during surge and fuses
when the line in exposed to a power cross.
Power-Up Sequence
The HC5513 has
no
required power-up sequence. This is a
result of the
D
ielectrically
I
solated (DI) process used in the
fabrication of the part. By using the DI process, care is no
longer required to insure that the substrate be kept at the
most negative potential as with junction isolated ICs.
Printed Circuit Board Layout
Care in the printed circuit board layout is essential for proper
operation. All connections to the RSN pin should be made
as close to the device pin as possible, to limit the
interference that might be injected into the RSN terminal. It
is good practice to surround the RSN pin with a ground
plane.
The analog and digital grounds should be tied together at
the device.
SLIC Operating States
f
3dB
HP
HP
)
----------------------------------------------------
=
(EQ. 28)
TABLE 1. LOGIC TRUTH TABLE
E0
E1
C1
C2
SLIC OPERATING STATE
ACTIVE DETECTOR
DET OUTPUT
0
0
0
0
Open Circuit
No Active Detector
Logic Level High
0
0
0
1
Active
Ground Key Detector
Ground Key Status
0
0
1
0
Ringing
No Active Detector
Logic Level High
0
0
1
1
Standby
Ground Key Detector
Ground Key Status
0
1
0
0
Open Circuit
No Active Detector
Logic Level High
0
1
0
1
Active
Loop Current Detector
Loop Current Status
0
1
1
0
Ringing
Ring Trip Detector
Ring Trip Status
0
1
1
1
Standby
Loop Current Detector
Loop Current Status
1
0
0
0
Open Circuit
No Active Detector
Logic Level High
1
0
0
1
Active
Ground Key Detector
1
0
1
0
Ringing
No Active Detector
1
0
1
1
Standby
Ground Key Detector
1
1
0
0
Open Circuit
No Active Detector
1
1
0
1
Active
Loop Current Detector
1
1
1
0
Ringing
Ring Trip Detector
1
1
1
1
Standby
Loop Current Detector
HC5513
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