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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 2001.07.01
Revised Date : 2001.07.26
Page No. : 3/3
H1N5820, H1N5821, H1N5822
HSMC Product Specification
DO-201 Dimension
*:Typical
Inches
Millimeters
Min.
1.20
25.40
7.20
Inches
Millimeters
Min.
25.40
4.80
DIM
Min.
0.0472
1.0000
0.2835
Max.
0.0512
-
0.3740
Max.
1.30
-
9.50
DIM
Min.
1.0000
0.1890
Max.
-
0.2087
Max.
-
5.30
A
B
C
D
E
Notes :
1.Dimension and tolerance based on our Spec. dated May 28,1998.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed.
Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 :
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
E
B
C
A
D
DO-201 Molded Plastic Package
HSMC Package Code: L