參數(shù)資料
型號(hào)： GTL2008PW
廠商： NXP Semiconductors N.V.
元件分類： 電壓/頻率轉(zhuǎn)換
英文描述： 12-bit GTL to LVTTL translator with power good control and high-impedance LVTTL and GTL outputs
封裝： GTL2008PW<SOT361-1 (TSSOP28)|<<http://www.nxp.com/packages/SOT361-1.html<1<Always Pb-free,;GTL2008PW<SOT361-1 (TSSOP28)|<<http://www.nxp.com/packages/SOT361-1.html<1&l
文件頁(yè)數(shù)： 16/22頁(yè)
文件大?。?/td> 191K
代理商： GTL2008PW
GTL2008_4
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 19 February 2010
16 of 22
NXP Semiconductors
GTL2008
GTL translator with power good control and high-impedance outputs
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reflow
soldering description”
.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GTL2008PW,112 功能描述:轉(zhuǎn)換 - 電壓電平 12-BIT XEON GTL TO RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8
GTL2008PW,118 功能描述:轉(zhuǎn)換 - 電壓電平 12-BIT XEON GTL TO RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8
GTL2008PW-T 功能描述:轉(zhuǎn)換 - 電壓電平 12-BIT XEON GTL TO LVTTL TRANS RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8
GTL2009 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:3-bit GTL Front-Side Bus frequency comparator
GTL2009PW 功能描述:校驗(yàn)器 IC 3-BIT FSB FREQ CMPR RoHS:否 制造商:STMicroelectronics 產(chǎn)品: 比較器類型: 通道數(shù)量: 輸出類型:Push-Pull 電源電壓-最大:5.5 V 電源電壓-最小:1.1 V 補(bǔ)償電壓（最大值）:6 mV 電源電流（最大值）:1350 nA 響應(yīng)時(shí)間: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SC-70-5 封裝:Reel
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