參數(shù)資料
型號: GTL2002GM
廠商: NXP Semiconductors N.V.
元件分類: 電壓/頻率轉(zhuǎn)換
英文描述: 2-bit bidirectional low voltage translator
封裝: GTL2002D/DG<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<Always Pb-free,;GTL2002D<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 5, 2
文件頁數(shù): 6/22頁
文件大小: 129K
代理商: GTL2002GM
GTL2002_7
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 2 July 2009
6 of 22
NXP Semiconductors
GTL2002
2-bit bidirectional low voltage translator
8.2 Unidirectional down translation
For unidirectional clamping, higher voltage to lower voltage, the GREF input must be
connected to DREF and both pins pulled to the higher side V
CC
through a pull-up resistor
(typically 200 k
). A filter capacitor on DREF is recommended. Pull-up resistors are
required if the chip set I/O are open-drain. The opposite side of the reference transistor
(SREF) is connected to the processor core supply voltage. When DREF is connected
through a 200 k
resistor to a 3.3 V to 5.5 V V
CC
supply and SREF is set between 1.0 V
to (V
CC
1.5 V), the output of each Sn has a maximum output voltage equal to SREF.
8.3 Unidirectional up translation
For unidirectional up translation, lower voltage to higher voltage, the reference transistor is
connected the same as for a down translation. A pull-up resistor is required on the higher
voltage side (Dn or Sn) to get the full HIGH level, since the GTL-TVC device will only pass
the reference source (SREF) voltage as a HIGH when doing an up translation. The driver
on the lower voltage side only needs pull-up resistors if it is open-drain.
Typical unidirectional HIGH-to-LOW voltage translation.
Fig 7.
Unidirectional down translation to protect low voltage processor pins
GREF
DREF
002aac061
D1
D2
200 k
CHIPSET I/O
V
CC
5 V
GND
SREF
S1
S2
CPU I/O
V
CORE
1.8 V
1.5 V
1.2 V
1.0 V
totem pole I/O
easy migration to lower voltage
as processor geometry shrinks
Typical unidirectional LOW-to-HIGH voltage translation.
Fig 8.
Unidirectional up translation to higher voltage chip sets
GREF
DREF
002aac062
D1
D2
200 k
CHIPSET I/O
V
CC
5 V
GND
SREF
S1
S2
CPU I/O
V
CORE
1.8 V
1.5 V
1.2 V
1.0 V
easy migration to lower voltage
as processor geometry shrinks
totem pole I/O
or open-drain
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