參數(shù)資料
型號： GS8644V36E-250
廠商： GSI TECHNOLOGY
元件分類： DRAM
英文描述： 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs
中文描述： 2M X 36 CACHE SRAM, 6.5 ns, PBGA165
封裝： 15 X 17 MM, 1 MM PITCH, FBGA-165
文件頁數(shù)： 28/40頁
文件大?。?/td> 843K
代理商： GS8644V36E-250
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.03 11/2004
28/40
2003, GSI Technology
JTAG TAP Block Diagram (2-die module)
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
Tap Controller Instruction Set
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
Instruction Register
ID Code Register
·
31 30 29
Boundary Scan Register
0
1
2
0
· · ·
1
2
0
Bypass Register
TDI
TDO
TMS
TCK
Test Access Port (TAP) Controller
1
·
1
0
·
·
·
·
·
·
·
·
·
Control Signals
·
Instruction Register
ID Code Register
·
31 30 29
Boundary Scan Register
0
1
2
0
· · ·
1
2
0
Bypass Register
TDI
TDO
Test Access Port (TAP) Controller
1
·
1
0
·
·
·
·
·
·
·
·
·
Control Signals
·
··
相關(guān)PDF資料
PDF描述
GS8644V36E-250I 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs
GS8644V72C-133 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs
GS8644V72C-133I 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs
GS8644V72C-150 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs
GS8644V72C-150I 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS8644V36E-250I 制造商:GSI 制造商全稱:GSI Technology 功能描述:4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs
GS8644V72C-133 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V 72MBIT 1MX72 8.5NS/3.5NS 209BGA - Trays
GS8644V72C-133I 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V 72MBIT 1MX72 8.5NS/3.5NS 209BGA - Trays
GS8644V72C-150 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V 72MBIT 1MX72 7.5NS/3.3NS 209BGA - Trays
GS8644V72C-150I 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V 72MBIT 1MX72 7.5NS/3.3NS 209BGA - Trays
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