參數(shù)資料
型號: GS8170DD36C-333I
廠商: GSI TECHNOLOGY
元件分類: DRAM
英文描述: 18Mb ヒ1x2Lp CMOS I/O Double Data Rate SigmaRAM
中文描述: 512K X 36 STANDARD SRAM, 1.8 ns, PBGA209
封裝: 14 X 22 MM, 1 MM PITCH, BGA-209
文件頁數(shù): 16/29頁
文件大?。?/td> 537K
代理商: GS8170DD36C-333I
GS8170DD36C-333/300/250/200
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 2.03 1/2005
16/29
2002, GSI Technology, Inc.
Input and Output Leakage Characteristics
Parameter
Symbol
Test Conditions
Min.
Max
Notes
Input Leakage Current
(except mode pins)
I
IL
V
IN
= 0 to V
DDQ
–2 uA
2 uA
ZQ, MCH, MCL, EP2, EP3
Pin Input Current
I
INM
V
IN
= 0 to V
DDQ
–50 uA
50 uA
Output Leakage Current
I
OL
Output Disable,
V
OUT
= 0 to V
DDQ
–2 uA
2 uA
Selectable Impedance Output Driver DC Electrical Characteristics
Parameter
Symbol
Test Conditions
Min.
Max
Notes
Low Drive Output High Voltage
V
OHL
I
OHL
= –4 mA
V
DDQ
– 0.4 V
1
Low Drive Output Low Voltage
V
OLL
I
OLL
= 4 mA
0.4 V
1
High Drive Output High Voltage
V
OHH
I
OHH
= –8 mA
V
DDQ
– 0.4 V
2
High Drive Output Low Voltage
V
OLH
I
OLH
= 8 mA
0.4 V
2
Notes:
1.
2.
ZQ = 1; High Impedance output driver setting
ZQ = 0; Low Impedance output driver setting
Operating Currents
Parameter
Symbol
-333
-300
-250
-200
Test Conditions
0°C
to
70°C
–40°C
to
+85°C
0°C
to
70°C
–40°C
to
+85°C
0°C
to
70°C
–40°C
to
+85°C
0°C
to
70°C
–40°C
to
+85°C
Operating
Current
x36
I
DDP
(PL)
345 mA
355 mA
320 mA
330 mA
275 mA
285 mA
225 mA
235 mA
E1
V
IL
Max.
tKHKH
tKHKH Min.
All other inputs
V
IL
V
IN
V
IH
E1
V
IH
Min. or
tKHKH
tKHKH Min.
All other inputs
V
IL
V
IN
V
IH
E2 or E3 False
tKHKH
tKHKH Min.
All other inputs
V
IL
V
IN
V
IH
Device Deselected
All inputs
V
SS
+ 0.10 V
V
IN
V
DD
– 0.10 V
Chip Disable
Current
x36
I
SB1
(PL)
75 mA
85 mA
70 mA
80 mA
65 mA
75 mA
60 mA
70 mA
Bank Deselect
Current
x36
I
SB2
(PL)
75 mA
85 mA
70 mA
80 mA
65 mA
75 mA
60 mA
70 mA
CMOS
Deselect
Current
I
DD3
45 mA
55 mA
45 mA
55 mA
45 mA
55 mA
45 mA
55 mA
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