參數(shù)資料
型號: GA3219
廠商: Gennum Corporation
英文描述: Venture-TM Digital DSP System
中文描述: 創(chuàng)業(yè)- TM數(shù)字DSP系統(tǒng)
文件頁數(shù): 3/24頁
文件大?。?/td> 261K
代理商: GA3219
GA3219 / GA3218 / GA3217 Preliminary Data Sheet
Proprietary and Confidential
32718 - 2
February 2005
3 of 24
Contents
Features........................................................................................................................1
thinSTAX PACKAGING.................................................................................................1
Description ....................................................................................................................1
1. Pad Connection.........................................................................................................4
2. Absolute Maximum Rating ........................................................................................4
3. Electrical Characteristics...........................................................................................5
4. Typical Applications ..................................................................................................7
5. Venture Overview......................................................................................................9
6. Signal Path..............................................................................................................10
7. Functional Block Description...................................................................................11
7.1 Adaptive Feeback Canceller .........................................................................11
7.2 Adaptive Noise Reduction .............................................................................11
7.3 A/D and D/A Converters ...............................................................................12
7.4 HRX Head Room Expander ..........................................................................12
7.5 FRONTWAVE Directionality .........................................................................12
7.6 Channel Processing ......................................................................................13
7.7 Telecoil Path .................................................................................................14
7.8 Graphic Equalizer .........................................................................................14
7.9 Biquad Filters ................................................................................................14
7.10 Volume Control ...........................................................................................15
7.11 AGCo and Peak Clipper ..............................................................................15
7.12 Memory Select Switches .............................................................................16
7.12.1 Momentary Switch on MS..................................................................16
7.12.2 Momentary Switch on MS, Static Switch on MS2
(jump to last memory)...................................................................................16
7.12.3 Static Switch on MS and MS2 ...........................................................17
7.12.4 Static Switch on MS, Static Switch on MS2
(jump to last memory)...................................................................................17
7.13 Audible Memory Change Indicator ..............................................................18
7.14 Tone Generator ...........................................................................................19
7.15 Cross Fader ................................................................................................19
7.16 Power-On/Power-Off Behavior and Low Battery Indicator ..........................19
7.17 Software And Security ................................................................................21
7.18 SDA Communication ...................................................................................21
7.19 Power Management ....................................................................................21
8. Package Dimensions ..............................................................................................22
8.1 Pad Location .................................................................................................23
9. Revision History ......................................................................................................24
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參數(shù)描述
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