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參數(shù)資料
| 型號： | G3VM-61H1(TR) |
| 元件分類： | 繼電器，輸入/輸出模塊 |
| 英文描述： | TRANSISTOR OUTPUT SOLID STATE RELAY, 1500 V ISOLATION-MAX |
| 封裝： | ROHS COMPLIANT, SOP-6 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 142K |
| 代理商： | G3VM-61H1(TR) |
5
G3VM Series
G3VM Series
Load Connection
Do not short-circuit the input and output terminals while the relay
is operating or the relay may malfunction.
Solder Mounting
Perform solder mounting under the following recommended con-
ditions to prevent the temperature of the Relays from rising.
<Flow Soldering>
Through-hole Mounting (Once Only)
Note:
We recommend that the suitability of solder mounting be
verified under actual conditions.
<Reflow Soldering>
Surface Mounting DIP or SOP Packages (Twice Max.)
Surface Mounting SSOP Packages (Twice Max.)
Note:
1.
We recommend that the suitability of solder mounting
be verified under actual conditions.
2.
Tape cut SSOPs are packaged without humidity resis-
tance. Use manual soldering to mount them.
Manual Soldering (Once Only)
Manually solder at 350
°
C for 3 s or less or at 260
°
C for 10 s or
less.
SSOP Handling Precautions
<Humidity-resistant Packaging>
Component packages can crack if surface-mounted components
that have absorbed moisture are subjected to thermal stress
when mounting. To prevent this, observe the following precau-
tions.
1. Unopened components can be stored in the packaging at 5
to 30
°
C and a humidity of 90% max., but they should be
used within 12 months.
2. After the packaging has been opened, components can be
stored at 5 to 30
°
C and a humidity of 60% max., but they
should be mounted within 168 hours.
3. If, after opening the packaging, the humidity indicator turns
pink to the 30% mark or the expiration data is exceeded,
bake the components while they are still on the taping reel,
and use them within 72 hours. Do not bake the same com-
ponents more than once.
Baking conditions: 60
±
5
°
C, 64 to 72 h
Expiration date:
12 months from the seal date
(given on the label)
4. If the same components are baked repeatedly, the tape
detachment strength will change, causing problems when
mounting. When mounting using dehumidifying measures,
always take countermeasures against component damage
from static electricity.
5. Do not throw or drop components. If the laminated packag-
ing material is damaged, airtightness will be lost.
6. Tape cut SSOPs are packaged without humidity resistance.
Use manual soldering to mount them.
AC Connection
DC Single Connection
DC Parallel Connection
Load
Load
Load
Load
Solder type
Lead solder
SnPb
Lead-free solder
SnAgCu
Preheating
150
°
C
60 to 120 s
150
°
C
60 to 120 s
Soldering
230 to 260
°
C
10 s max.
245 to 260
°
C
10 s max.
Solder type
Lead solder
SnPb
Lead-free solder
SnAgCu
Preheating
140
→
160
°
C
60 to 120 s
180
→
190
°
C
60 to 120 s
Soldering
210
°
C
30 s max.
230
°
C
30 to 50 s
Peak
240
°
C max.
Peak
260
°
C max.
Solder type
Lead solder
SnPb
Lead-free solder
SnAgCu
Preheating
140
→
160
°
C
60 to 120 s
150
→
180
°
C
120 s max.
Soldering
210
°
C
30 s max.
230
°
C
30 s max.
Peak
240
°
C max.
Peak
250
°
C max.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| G3VM61HR | 制造商:Omron Electronic Components LLC 功能描述:HIGH CURRENT MOS FET - Rail/Tube 制造商:Omron Electronic Components LLC 功能描述:RELAY SSR SPST 60V 2.3A 6SOP |
| G3VM-61HR | 功能描述:固態(tài)繼電器-PCB安裝 60V SPST-NO SOP6 SMT 2300mA .04ohm 70pF RoHS:否 制造商:Omron Electronics 控制電壓范圍: 負載電壓額定值:40 V 負載電流額定值:120 mA 觸點形式:1 Form A (SPST-NO) 輸出設(shè)備:MOSFET 封裝 / 箱體:USOP-4 安裝風格:SMD/SMT |
| G3VM-61HR(TR) | 功能描述:固態(tài)繼電器-PCB安裝 60V SPST-NO SOP6 SMT 2300mA .04ohm 70pF RoHS:否 制造商:Omron Electronics 控制電壓范圍: 負載電壓額定值:40 V 負載電流額定值:120 mA 觸點形式:1 Form A (SPST-NO) 輸出設(shè)備:MOSFET 封裝 / 箱體:USOP-4 安裝風格:SMD/SMT |
| G3VM61HRTR | 制造商:Omron Electronic Components LLC 功能描述:HIGH CURRENT MOS FET T/R - Tape and Reel 制造商:Omron Electronic Components LLC 功能描述:RELAY SSR SPST 60V 2.3A 6SOP |
| G3VM61LR | 制造商:Omron Electronic Components LLC 功能描述:RLY SSR 50MA 1.3V DC-IN 0.4A 60V AC-OUT 4SSOP - Rail/Tube 制造商:Omron Electronic Components LLC 功能描述:RELAY SSR SPST 60V 4SSOP |
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