參數(shù)資料
型號(hào)： FSMD150-1206
廠商： Electronic Theatre Controls, Inc.
英文描述： Surface Mount PTC FSMD1206 Series
中文描述： 表面貼裝PTC的FSMD1206系列
文件頁數(shù)： 1/4頁
文件大小： 116K
代理商： FSMD150-1206
NOTE : All Specification subject to change without notice
.
49
Electrical Characteristics(23
℃
)
Max Time to Trip
Power Current Time
Pd
,
W
A
0.4
0.25
0.4
0.50
0.4
8.00
0.4
8.00
0.4
8.00
0.6
8.00
0.6
8.00
0.8
8.00
Resistance
Tolerance
R
MIN
Ω
3.60
1.60
0.60
0.30
0.15
0.10
0.055
0.040
Hold
Current
Trip
Current
Rated
Voltage
Max
Current
Typical
R1
MAX
Ω
50.00
15.00
2.50
1.20
0.70
0.29
0.210
0.120
Part
Number
I
H
,
A
0.05
0.10
0.20
0.35
0.50
0.75
1.00
1.50
I
T
,
A
0.15
0.25
0.40
0.75
1.00
1.50
1.80
3.00
V
MAX
,
Vdc
60
60
30
16
8
6
6
6
I
MAX
, A
10
10
10
40
40
40
40
40
Sec
1.50
1.00
0.05
0.10
0.10
0.20
0.30
1.00
FSMD005-1206
FSMD010-1206
FSMD020-1206
FSMD035-1206
FSMD050-1206
FSMD075-1206
FSMD100-1206
FSMD150-1206
I
H
=Hold current-maximum current at which the device will not trip at 23
℃
still air.
I
T
=Trip current-minimum current at which the device will always trip at 23
℃
still air.
V
MAX
=Maximum voltage device can withstand without damage at it rated current.(I max)
I
= Maximum fault current device can withstand without damage at rated voltage (V max).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23
℃
still air environment.
R
MIN
=Minimum device resistance at 23
℃
prior to tripping.
R
1
=Maximum device resistance at 23
℃
measured 1 hour post trip.
Termination pad characteristics
Termination pad materials : solder-plated copper
※
Lead Free Component
Application:
All high-density boards
Product Features:
Small surface mount, Solid state
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current:
50mA~1.5A
Maximum Voltage:
6V~60V
Temperature Range:
-40
℃
to 85
℃
Agency Recognition
:
Pending
FSMD1206 Series
Surface Mount PTC
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