參數(shù)資料
型號(hào): FIN212ACGFX
廠商: Fairchild Semiconductor
文件頁(yè)數(shù): 6/16頁(yè)
文件大?。?/td> 0K
描述: IC SER/DESER 12BIT 42USS-BGA
標(biāo)準(zhǔn)包裝: 1
系列: SerDes™
功能: 串行器/解串器
數(shù)據(jù)速率: 560Mbps
輸入類(lèi)型: LVCMOS
輸出類(lèi)型: LVCMOS
輸入數(shù): 12
輸出數(shù): 12
電源電壓: 1.65 V ~ 3.6 V
工作溫度: -30°C ~ 70°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 42-VFBGA
供應(yīng)商設(shè)備封裝: 42-BGA
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 1216 (CN2011-ZH PDF)
其它名稱(chēng): FIN212ACGFXDKR
2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FIN212AC Rev. 1.1.1
14
S
erDe
s
FIN212
AC
12
-Bit
Se
rial
izer
/
De
seriali
zer
Suppo
rti
ng
Ca
meras
and
Small
Displays
Physical Dimensions
5.00
0.80 MAX
0.10 C
SEATING
PLANE
0.08 C
0.05
0.00
(0.20)
C
0.15 C
PIN #1 IDENT
0.50
PIN #1 IDENT
3.70
3.50
0.45
0.35
3.70
3.50
0.50
0.10
C A B
0.05
C
0.18-0.30
A
B
5.38 MIN
0.20MIN
3.86 MIN
3.37 MAX
0.28 MAX
0.50TYP
(0.76)
X4
X40
E
(DATUM B)
(DATUM A)
PIN #1 ID
(0.25 )
NOTES:
A. CONFORMS TO JEDEC REGISTRATION MO-220, VARIATION
WHHD-4. THIS PACKAGE IS ALSO FOOTPRINT COMPATIBLE WITH
WHHD-5.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994.
D. LAND PATTERN PER IPC SM-782.
E. WIDTH REDUCED TO AVOID SOLDER BRIDGING.
F. DIMENSIONS ARE NOT INCLUSIVE OF BURRS, MOLD FLASH, OR
TIE BAR PROTRUSIONS.
G. DRAWING FILENAME: MKT-MLP32Arev3.
Figure 10. 32-Lead, Molded Leadless Package (MLP)
Order Number
Operating Temperature Range
Package Description
Packing Method
FIN212ACMLX
-30 to 70°C
32-Terminal Molded Leadless Package (MLP),
Quad, JEDEC MO-220, 5mm Square
Tape & Reel
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
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