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參數(shù)資料
| 型號： | FH25-33S-0.3SH |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. |
| 中文描述： | 聯(lián)系間距0.3毫米，0.9以上的電路板，柔性線路板中頻連接毫米。 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 482K |
| 代理商： | FH25-33S-0.3SH |
7
B
Recommended Temperature Profile
G
Using Typical Solder Paste
HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s Part Number:
SENSBY NR-
2
)
:Room air
Solder composition :Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.’s Part Number:
OZ63-201C-50-9)
Test board
:Glass epoxy 70mm∞80mm∞1.6mm thick
Land dimensions:
0.3mm∞0.65mm,0.3mm∞0.8mm
Metal mask
:0.23∞0.55∞0.1mm thick,
0.23∞0.65∞0.1mm thick
Environment
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
Start
Preheating
Soldering
T
)
Time (Seconds)
60
25(60sec.)
20 sec. to 30 sec.
(30sec.)
60 sec. to 90 sec.
0
50
100
150
150
160
240
200
5 sec. max.
200
250
120
HRS test condition
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s Part Number:
SENSBY NR-
2
)
Environment
:Room air
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.’s Part Number:
M705-221CM5-42-10.5)
Test board
:Glass epoxy 70mm∞80mm∞1.6mm thick
Land dimensions:
0.3mm∞0.65mm, 0.3mm∞0.8mm
Metal mask
:0.23∞0.55∞0.1mm thick,
0.23∞0.65∞0.1mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
MAX 250
60
2560sec.)
(60sec.)
60 sec. to 120 sec.
0
50
100
150
150
200
230
200
250
120
Start
Preheating
Soldering
T
)
Time (Seconds)
G
Using Lead-free Solder Paste
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| FH25-39S-0.3SH | 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. |
| FH25-45S-0.3SH | MS3108A16-11S |
| FH26-21S-0.3SHW | 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors |
| FH26-13S-0.3SHW | CABLE, EFGLAS, 16AWG, WHITE, 100M; Area, conductor CSA:1.34mm2; Conductor make-up:19/0.3 mm; Voltage rating, AC:600V; Current rating:20A; Colour, primary insulation:White; Material, primary insulation:PTFE; Diameter, External:2.8mm; RoHS Compliant: Yes |
| FH26-41S-0.3SHW | 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FH25-36.4X7.6X2.8 | 制造商:KE KITAGAWA 功能描述:FERRITE PLATE 25WAY 制造商:KE KITAGAWA 功能描述:FERRITE PLATE, 25WAY 制造商:KE KITAGAWA 功能描述:FERRITE PLATE, 25WAY; Accessory Type:Ferrite Plate; Core Size:36.4mm x 7.6mm; For Use With:D Sub Connectors ;RoHS Compliant: Yes |
| FH25-39S-0.3SH | 制造商:HRS 制造商全稱:HRS 功能描述:0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. |
| FH25-39S-0.3SH(05) | 制造商:Hirose 功能描述:CONN 39POS FPC 0.3MM SMD GOLD |
| FH25-45S-0.3SH | 制造商:HRS 制造商全稱:HRS 功能描述:0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. |
| FH25-45S-0.3SH(05) | 制造商:Hirose 功能描述:CONN 45POS FPC 0.3MM SMD GOLD |
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