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參數(shù)資料
| 型號： | FH23-71S-0.3SHAW |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors |
| 中文描述： | 0.3毫米間距聯(lián)系，高于板，柔性線路板連接器一點二五毫米 |
| 文件頁數(shù)： | 8/10頁 |
| 文件大?。?/td> | 644K |
| 代理商： | FH23-71S-0.3SHAW |
8
B
Recommended Temperature Profile
G
Using Typical Solder Paste
HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s
Part Number: SENSBY NR-
2
)
:Room air
:Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.’s
Part Number: OZ63-201C-50-9)
:
Glass epoxy 45mm∞100mm∞1.6mm thick
:Lead type 0.3mm∞1.25mm,
0.3mm∞0.7mm
Leadless type 0.3mm∞1.25mm,
0.3mm∞0.65mm
:Lead type
0.25mm∞1.25mm∞0.1mm thick
0.25mm∞0.7mm∞0.1mm thick
Leadless type
0.25mm∞1.25mm∞0.1mm thick
0.25mm∞0.65mm∞0.1mm thick
Environment
Solder composition
Test board
Land dimensions
Metal mask
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
HRS test condition
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s
Part Number: SENSBY NR-
2
)
:Room air
:Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.’s
Part Number: M705-221CM5-42-10.5)
:
Glass epoxy 45mm∞100mm∞1.6mm thick
: Lead type 0.3mm∞1.25mm,
0.3mm∞0.7mm
Leadless type 0.3mm∞1.25mm,
0.3mm∞0.65mm
: Lead type
0.25mm∞1.25mm∞0.1mm thick
0.25mm∞0.7mm∞0.1mm thick
Leadless type
0.25mm∞1.25mm∞0.1mm thick
0.25mm∞0.65mm∞0.1mm thick
Environment
Solder composition
Test board
Land dimensions
Metal mask
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult tour solder paste and equipment
manufacturer for specific recommendations.
Start
T
()
Time (Seconds)
60
25(60 sec.)
(20 sec.
to 30 sec.)
(30 sec.)
60 sec. to 90 sec.
Preheating
Soldering
0
50
100
150
150
160
240
200
5 sec. Max.
200
250
120
Max. 250
Start
Time (Seconds)
60
25(60 sec.)
(60 sec.)
90 sec. to 120 sec.
Preheating
Soldering
0
50
100
150
150
200
230
200
250
120
T
()
G
Using Lead-free Solder paste
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| FH23-71S-0.3SHW | 0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
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| FH23BM | 功能描述:熔絲座 BUSS FUSEBLOCK RoHS:否 制造商:Littelfuse 產(chǎn)品: 電流額定值:30 A 電壓額定值:1000 VDC 極數(shù):1 系列: 安裝風(fēng)格:DIN Rail 端接類型: 軸類型: 工作溫度范圍: |
| FH23CM | 功能描述:熔絲座 BUSS FUSEBLOCK RoHS:否 制造商:Littelfuse 產(chǎn)品: 電流額定值:30 A 電壓額定值:1000 VDC 極數(shù):1 系列: 安裝風(fēng)格:DIN Rail 端接類型: 軸類型: 工作溫度范圍: |
| FH23EM | 功能描述:熔絲座 BUSS FUSEBLOCK RoHS:否 制造商:Littelfuse 產(chǎn)品: 電流額定值:30 A 電壓額定值:1000 VDC 極數(shù):1 系列: 安裝風(fēng)格:DIN Rail 端接類型: 軸類型: 工作溫度范圍: |
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