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參數(shù)資料
| 型號： | FH23-45S-0.3SHW |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors |
| 中文描述： | 0.3毫米間距聯(lián)系，高于板，柔性線路板連接器一點二五毫米 |
| 文件頁數(shù)： | 8/10頁 |
| 文件大?。?/td> | 644K |
| 代理商： | FH23-45S-0.3SHW |
8
B
Recommended Temperature Profile
G
Using Typical Solder Paste
HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s
Part Number: SENSBY NR-
2
)
:Room air
:Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.’s
Part Number: OZ63-201C-50-9)
:
Glass epoxy 45mm∞100mm∞1.6mm thick
:Lead type 0.3mm∞1.25mm,
0.3mm∞0.7mm
Leadless type 0.3mm∞1.25mm,
0.3mm∞0.65mm
:Lead type
0.25mm∞1.25mm∞0.1mm thick
0.25mm∞0.7mm∞0.1mm thick
Leadless type
0.25mm∞1.25mm∞0.1mm thick
0.25mm∞0.65mm∞0.1mm thick
Environment
Solder composition
Test board
Land dimensions
Metal mask
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
HRS test condition
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s
Part Number: SENSBY NR-
2
)
:Room air
:Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.’s
Part Number: M705-221CM5-42-10.5)
:
Glass epoxy 45mm∞100mm∞1.6mm thick
: Lead type 0.3mm∞1.25mm,
0.3mm∞0.7mm
Leadless type 0.3mm∞1.25mm,
0.3mm∞0.65mm
: Lead type
0.25mm∞1.25mm∞0.1mm thick
0.25mm∞0.7mm∞0.1mm thick
Leadless type
0.25mm∞1.25mm∞0.1mm thick
0.25mm∞0.65mm∞0.1mm thick
Environment
Solder composition
Test board
Land dimensions
Metal mask
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult tour solder paste and equipment
manufacturer for specific recommendations.
Start
T
()
Time (Seconds)
60
25(60 sec.)
(20 sec.
to 30 sec.)
(30 sec.)
60 sec. to 90 sec.
Preheating
Soldering
0
50
100
150
150
160
240
200
5 sec. Max.
200
250
120
Max. 250
Start
Time (Seconds)
60
25(60 sec.)
(60 sec.)
90 sec. to 120 sec.
Preheating
Soldering
0
50
100
150
150
200
230
200
250
120
T
()
G
Using Lead-free Solder paste
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| FH23-15S-0.3SHW | 0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| FH-23469-000 | 功能描述:揚聲器與變頻器 5.09 X 2.80 X 2.59MM 99.5 SENS, 12S PORT RoHS:否 制造商:PUI Audio 產品:Speakers 類型:Electromagnetic 頻率:900 Hz to 12 kHz 聲壓級:88 dBA 阻抗:8 Ohms 功率額定值:1.2 W 形狀:Round 端接類型:Solder Pad 直徑:15 mm 長度: 寬度: 深度:4.4 mm 磁體材料:Neodymium Iron Boran (NdFeB) 圓錐體材料:Mylar |
| FH23-51S-0.3SHAW | 制造商:HRS 制造商全稱:HRS 功能描述:0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors |
| FH23-51S-0.3SHAW(05) | 功能描述:FFC & FPC連接器 51P F SOCKET SMT HORIZON MNT LEADLESS RoHS:否 制造商:JAE Electronics 產品類型:Plugs 系列:HD 節(jié)距:0.5 mm 位置/觸點數(shù)量:40 安裝角: 安裝風格:Cable 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:100 V per contact 電流額定值:0.24 A to 1 A |
| FH23-51S-0.3SHAW(06) | 功能描述:FFC & FPC連接器 0.3MM 51 POS R/A SMT NO LEADS, GOLD FLASH RoHS:否 制造商:JAE Electronics 產品類型:Plugs 系列:HD 節(jié)距:0.5 mm 位置/觸點數(shù)量:40 安裝角: 安裝風格:Cable 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:100 V per contact 電流額定值:0.24 A to 1 A |
| FH23-51S-0.3SHAW(52) | 功能描述:FFC & FPC連接器 Obsolete RoHS:否 制造商:JAE Electronics 產品類型:Plugs 系列:HD 節(jié)距:0.5 mm 位置/觸點數(shù)量:40 安裝角: 安裝風格:Cable 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:100 V per contact 電流額定值:0.24 A to 1 A |
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