參數(shù)資料
型號: FH19-50S-0.5SH
廠商: Hirose Electric USA, INC.
英文描述: 0.5mm pitch, 0.9mm above the board, Flexible Printed Circuit & Flexible Flat Cable Connectors
中文描述: 0.5mm間距,0.9毫米以上的板,柔性線路板
文件頁數(shù): 8/9頁
文件大?。?/td> 338K
代理商: FH19-50S-0.5SH
45
B
Recommended Temperature Profile
[For FH19 & FH19S Series]
HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s
Part Number: SENSBY NR-
2
)
:Room air
:Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.’s Part
Number: OZ63-201C-50-9)
:
Glass epoxy 45mm∞100mm∞1.6mm thick
:0.3mm∞0.8mm
:0.25mm∞0.8mm∞0.1mm thick
Environment
Solder composition
Test board
Land dimensions
Metal mask
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
Start
T
Time (Seconds)
60
25(60 sec.)
(20 sec.
to 30 sec.)
(30 sec.)
60 sec. to 90 sec.
Preheating
Soldering
0
50
100
150
150
160
240
200
5 sec. Max.
200
250
120
G
Using Typical Solder Paste
HRS test condition
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s
Part Number: SENSBY NR-
2
)
:Room air
:Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.’s Part
Number:M705-221CM5-42-10.5)
:
Glass epoxy 45mm∞100mm∞1.6mm thick
: 0.3mm∞0.8mm
:0.25mm∞0.8mm∞0.1mm
Environment
Solder composition
Test board
Land dimensions
Metal mask
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult tour solder paste and equipment
manufacturer for specific recommendations.
MAX 250
Start
Time (Seconds)
60
25(60 sec.)
(60 sec.)
90 sec. to 120 sec.
Preheating
Soldering
0
50
100
150
150
200
230
200
250
120
T
G
Using Lead-free Solder paste
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PDF描述
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