參數(shù)資料
型號(hào)： FC80960HT75SL2GT
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 80960HA/HD/HT 32-Bit High-Performance Superscalar Processor
中文描述： 32-BIT, 75 MHz, RISC PROCESSOR, PQFP208
封裝： PLASTIC, QFP-208
文件頁(yè)數(shù)： 30/102頁(yè)
文件大?。?/td> 828K
代理商： FC80960HT75SL2GT
80960HA/HD/HT
24
Advance Information
Datasheet
Table 12. Maximum T
A
at Various Airflows in °C (PGA Package Only)
Airflow-ft/min (m/sec)
f
CLKIN
(MHz)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
Core
1X Bus
Clock
T
with
Heatsink*
25
33
40
69
63
59
74
70
67
78
75
73
79
77
75
80
79
77
80
79
77
T
without
Heatsink
25
33
40
64
56
50
67
62
56
71
67
63
74
70
67
75
72
69
76
74
71
Core
2X Bus
Clock
T
with
Heatsink*
16
25
33
40
68
58
49
41
73
66
60
55
77
73
69
65
79
75
71
68
80
77
74
72
80
77
74
72
T
without
Heatsink
16
25
33
40
62
49
38
27
66
56
46
38
71
62
55
48
73
66
60
55
75
68
63
58
76
71
66
62
Core
3X Bus
Clock
T
with
Heatsink*
20
25
53
45
63
58
71
67
73
70
76
73
76
73
T
without
Heatsink
20
25
43
33
51
42
58
51
63
58
66
61
68
64
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Table 13. 80960Hx 168-Pin PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.07)
800
(4.06)
1000
(5.07)
θ
Junction-to-Case
(Case measured as
shown in
Figure 5
)
1.5
1.5
1.5
1.5
1.5
1.5
θ
Case-to-Ambient
(No Heatsink)
17
14
11
9
8
7
θ
Case-to-Ambient
(With Heatsink)*
13
9
6
5
4
4
NOTES:
1. This table applies to 80960Hx PGA plugged into socket or soldered directly to board.
2.
θ
=
θ
+
θ
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
θ
JC
θ
JA
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