3-4 Revision 10 Datasheet Categories Categories In order to provide the latest information to designers, some datashe" />
參數(shù)資料
型號: EX128-TQG64
廠商: Microsemi SoC
文件頁數(shù): 41/48頁
文件大?。?/td> 0K
描述: IC FPGA ANTIFUSE 6K 64-TQFP
標(biāo)準(zhǔn)包裝: 160
系列: EX
邏輯元件/單元數(shù): 256
輸入/輸出數(shù): 46
門數(shù): 6000
電源電壓: 2.3 V ~ 2.7 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 64-LQFP
供應(yīng)商設(shè)備封裝: 64-TQFP(10x10)
Datasheet Information
3-4
Revision 10
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheet parameters are published before
data has been fully characterized from silicon devices. The data provided for a given device, as
highlighted in the "eX Device Status" table on page II, is designated as either "Product Brief," "Advance,"
"Preliminary," or "Production." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains general
product information. This document gives an overview of specific device and family information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production. This label only applies to the
DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not
been fully characterized.
Preliminary
The datasheet contains information based on simulation and/or initial characterization. The information is
believed to be correct, but changes are possible.
Production
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The product described in this datasheet is subject to the Export Administration Regulations (EAR). They
could require an approved export license prior to export from the United States. An export includes
release of product or disclosure of technology to a foreign national inside or outside the United States.
相關(guān)PDF資料
PDF描述
RMC50DRXH CONN EDGECARD 100PS DIP .100 SLD
EX128-TQ64 IC FPGA ANTIFUSE 6K 64-TQFP
AGLP030V5-VQ128I IC FPGA IGLOO PLUS 30K 128-VQFN
HMC40DRXI CONN EDGECARD 80POS DIP .100 SLD
AGLP030V5-VQG128I IC FPGA IGLOO PLUS 30K 128-VQFN
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EX128-TQG64A 功能描述:IC FPGA ANTIFUSE 6K 64-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:EX 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
EX128-TQG64I 功能描述:IC FPGA ANTIFUSE 6K 64-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:EX 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
EX12BTQ64I 制造商:ACTEL 功能描述:New
EX12L-120PC/3E-GL/L 制造商:Hirose 功能描述:
EX12L-120PC/3E-GL/L(50) 功能描述:集管和線殼 HIROSE ELECTRIC RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點類型:Pin (Male) 節(jié)距:1 mm 位置/觸點數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Brass 觸點電鍍:Gold 制造商:Hirose Connector