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參數(shù)資料
| 型號(hào)： | ESD4-LFC |
| 廠商： | PROTEK DEVICES |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | LOW CAPACITANCE FLIP CHIP ARRAY |
| 中文描述： | 200 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE |
| 封裝： | ROHS COMPLIANT, FLIP CHIP-5 |
| 文件頁數(shù)： | 3/4頁 |
| 文件大小： | 64K |
| 代理商： | ESD4-LFC |
3
05210.R3 2/07
www.protekdevices.com
ESD4-LFC
APPLICATION INFORMATION
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S
- Preheat
T
SMAX
T
SMIN
T
L
t 25°C to Peak
30-60 seconds
T
T
P
155°
140°
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50μm
±20μm
60 Seconds
270°C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270°C
T
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
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| ESD4-LFC_07 | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:LOW CAPACITANCE FLIP CHIP ARRAY |
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