參數(shù)資料
型號(hào)： EPF6024AQC208-2
廠(chǎng)商： Altera
文件頁(yè)數(shù)： 45/52頁(yè)
文件大小： 0K
描述： IC FLEX 6000 FPGA 24K 208-PQFP
產(chǎn)品培訓(xùn)模塊： Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝： 144
系列： FLEX 6000
LAB/CLB數(shù)： 196
邏輯元件/單元數(shù)： 1960
輸入/輸出數(shù)： 171
門(mén)數(shù)： 24000
電源電壓： 3 V ~ 3.6 V
安裝類(lèi)型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 208-BFQFP
供應(yīng)商設(shè)備封裝： 208-PQFP（28x28）
其它名稱(chēng)： 544-1284
Altera Corporation
5
FLEX 6000 Programmable Logic Device Family Data Sheet
Functional
Description
The FLEX 6000 OptiFLEX architecture consists of logic elements (LEs).
Each LE includes a 4-input look-up table (LUT), which can implement any
4-input function, a register, and dedicated paths for carry and cascade
chain functions. Because each LE contains a register, a design can be easily
pipelined without consuming more LEs. The specified gate count for
FLEX 6000 devices includes all LUTs and registers.
LEs are combined into groups called logic array blocks (LABs); each LAB
contains 10 LEs. The Altera software automatically places related LEs into
the same LAB, minimizing the number of required interconnects. Each
LAB can implement a medium-sized block of logic, such as a counter or
multiplexer.
Signal interconnections within FLEX 6000 devices—and to and from
device pins—are provided via the routing structure of the FastTrack
Interconnect. The routing structure is a series of fast, continuous row and
column channels that run the entire length and width of the device. Any
LE or pin can feed or be fed by any other LE or pin via the FastTrack
Interconnect. See “FastTrack Interconnect” on page 17 of this data sheet
for more information.
Each I/O pin is fed by an I/O element (IOE) located at the end of each row
and column of the FastTrack Interconnect. Each IOE contains a
bidirectional I/O buffer. Each IOE is placed next to an LAB, where it can
be driven by the local interconnect of that LAB. This feature allows fast
clock-to-output times of less than 8 ns when a pin is driven by any of the
10 LEs in the adjacent LAB. Also, any LE can drive any pin via the row and
column interconnect. I/O pins can drive the LE registers via the row and
column interconnect, providing setup times as low as 2 ns and hold times
of 0 ns. IOEs provide a variety of features, such as JTAG BST support,
slew-rate control, and tri-state buffers.
Figure 1 shows a block diagram of the FLEX 6000 OptiFLEX architecture.
Each group of ten LEs is combined into an LAB, and the LABs are
arranged into rows and columns. The LABs are interconnected by the
FastTrack Interconnect. IOEs are located at the end of each FastTrack
Interconnect row and column.
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參數(shù)描述
EPF6024AQC208-2N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC208-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC208-3N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC240-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Flex 6000 196 LABs 199 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC240-1N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Flex 6000 196 LABs 199 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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