參數(shù)資料
型號: EPF10K200EFC672-1
英文描述: Field Programmable Gate Array (FPGA)
中文描述: 現(xiàn)場可編程門陣列(FPGA)
文件頁數(shù): 27/120頁
文件大?。?/td> 1901K
代理商: EPF10K200EFC672-1
14
Altera Corporation
FLEX 10KE Embedded Programmable Logic Family Data Sheet
When used as RAM, each EAB can be configured in any of the following
sizes: 256
× 16, 512 × 8, 1,024 × 4, or 2,048 × 2 (see Figure 5).
Figure 5. FLEX 10KE EAB Memory Congurations
Larger blocks of RAM are created by combining multiple EABs. For
example, two 256
× 16 RAM blocks can be combined to form a 256 × 32
block; two 512
× 8 RAM blocks can be combined to form a 512 × 16 block
Figure 6. Examples of Combining FLEX 10KE EABs
If necessary, all EABs in a device can be cascaded to form a single RAM
block. EABs can be cascaded to form RAM blocks of up to 2,048 words
without impacting timing. The MAX+PLUS II software automatically
combines EABs to meet a designer’s RAM specifications.
256
× 16
512
× 8
1,024
× 4
2,048
× 2
512
× 8
512
× 8
256
× 16
256
× 16
256
× 32
512
× 16
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相關代理商/技術參數(shù)
參數(shù)描述
EPF10K200EFC672-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 470 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200EFC672-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 1248 LABs 470 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200EGC599-1 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Altera Corporation 功能描述:
EPF10K200EGC599-2 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Altera Corporation 功能描述:
EPF10K200EGC599-3 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Altera Corporation 功能描述: